1)  W/Cu
W/Cu
1.
W/Cu functionally graded materials(FGMs) doping 1%La2O3 and 1%TiC respectively were prepared by a way of graded sintering under ultra-high pressure(GSUHP).
采用超高压力通电烧结工艺制备了添加1%TiC和1%La2O3的W/Cu功能梯度材料(FGMs),分析研究了其烧结性能、层间剪切强度及抗热冲击性能。
2.
W/Cu functionally gradient materials(FGMs) containing 1%La2O3 and 1%TiC respectively were prepared by a way of graded sintering under ultra-high pressure (GSUHP).
通过超高压力通电烧结制备了添加1%TiC和1%La2O3的W/Cu FGM,研究了其烧结、层间剪切强度及抗热冲击性能;此功能梯度材料气孔率在11%左右;在激光功率密度200 mW。
2)  W/Cu
钨/铜
1.
The processes and theories of fabrication of dispersed strengthened copper matrix composites and C/Cu composites and W/Cu composites for spot welding electrodes are introduced in detail.
重点介绍了点焊电极用弥散强化铜基复合材料、碳/铜复合材料和钨/铜复合材料的制备工艺和强化原理。
3)  W/Cu
W/Cu功能梯度材料
1.
W/Cu functionally graded material (FGM) was fabricated by infiltration-welding method.
采用熔渗－焊接法经过梯度W骨架制备，渗Cu及热压焊接三个步骤制备出W／Cu功能梯度材料。
4)  W-Cu
W-Cu
1.
Development of W-Cu and Mo-Cu Composites by MIM;
注射成形W-Cu及Mo-Cu研究进展
2.
Effect of Infiltrating Temperature and Annealing Temperature on Thermal Conductivity of W-Cu Composites;
熔渗温度及退火温度对W-Cu电子封装材料导热性能的影响
3.
Phase transformation of sol-spray dried W-Cu precursor powder during calcining;
溶胶-喷雾干燥W-Cu前驱体粉末煅烧过程中的相变
5)  W-Cu
钨铜
1.
Research on Fabrication of W-Cu Nanocomposite Powder;
钨铜纳米复合粉末的制备技术研究
2.
CURRENT STATUS OF R&D OF W-Cu COMPOSITE MATERIALS IN CHINA AND ABROAD;
国内外钨铜复合材料的研究现状
3.
It turned out that compared with W-Cu alloys, high-density Mo-Cu alloys were more difficult to obtain in thermodynamics unless special technique was adopted; Mo-Cu alloys were excellent for its lower density, bet.
讨论了采用熔渗法制备高密度钨铜和钼铜合金,综合其密度、比热容、热膨胀系数、导热系数等基本数据,比较了合金的热物理性能及其应用上的特点。
6)  W-Cu
钨-铜
参考词条
补充资料：A1-Cu-Co合金中十次对称准晶单晶体及其衍射图


A1-Cu-Co合金中十次对称准晶单晶体及其衍射图


　　‘ Al Cu—Co合金中十次对称准晶堕晶体e1)及其衍射圈(z) 中国科学盹垒禹研览听供稿
　　
说明：补充资料仅用于学习参考，请勿用于其它任何用途。