1) electroless gold plating
化学镀金
1.
The progress in research on non-cyanide electroless gold plating is reviewed.
综述了化学镀金的研究进展。
2.
The paper is to be published in two parts, introducing the electroless gold plating process in electronic plating industry in Japan.
本文分2部分,介绍了日本电子电镀工业化学镀金工艺。
3.
The second part of the article discusses the method improving the stability of bath systems of potassium borohydride and DMAB, and introduces new electroless gold plating systems, including bath systems of NaAuCl4 with amine borane as reducer, sulfite and thiosulfate.
文章第二部分论述了提高硼氢化钾和DMAB体系镀液稳定性的方法,并介绍了新型化学镀金体系:NaAuCl4的胺硼烷镀液体系、亚硫酸盐镀液体系和硫代硫酸盐镀液体系。
2) electroless gold
化学镀金
1.
The paper introduced a displacement electroless gold plating solution IG-600 for electroless nickel/immersion gold(ENIG) process in printed circuit boards.
文章介绍一种用于电路板化学镀镍/沉金工艺的置换型化学镀金液IG-600。
3) Chemical alloy planting
化学镀合金
4) electroless nickel and immersion gold
化学镀镍金
1.
Application of electroless nickel and immersion gold in the manufacturing of the printed circuit board;
化学镀镍金在印制电路板制造中的应用
5) electroless metal plating
化学镀金属
6) electroless imitation gold plating
化学镀仿金
1.
A new technology of electroless imitation gold plating on surface of steel and iron articles was studied successfully by means of combination with electroless nickel plating and chemical immersion plating imitation gold.
采用化学镀镍与化学浸镀仿金工艺组合,研究成功了一种新的钢铁件化学镀仿工艺,探讨了化学镀仿金液中主要成分硫酸铜、硫酸亚锡、络合剂、稳定剂等及工艺条件温度、施镀时间对仿金层质量的影响。
补充资料：工程化学障碍物(见化学障碍物)
工程化学障碍物(见化学障碍物)
engineering-chemical obstacle
习U·上日、11匕I一9 nuQXue Zhang’aiwu工程化学障碍物(engineelsng一ehemiealobstacle)见化学障碍物。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条