1) mold filling
充型
1.
Study on mold filling in AZ91 alloy LFC process;
AZ91合金消失模铸造充型过程研究
2.
Numerical simulation of mold filling and water analog verification;
充型过程的数值模拟及水力模拟实验验证
3.
Numerical Simulation of Mold Filling of Expendable Pattern Casting (EPC) Process;
消失模铸造充型过程数值模拟
2) filling
[英]['fɪlɪŋ] [美]['fɪlɪŋ]
充型
1.
Computer Simulation on Filling and Solidification Process of Antigravity Casting of AZ91D Magnesium Alloys;
AZ91D镁合金反重力铸造充型及凝固过程计算机模拟
2.
Computer Aided Simulated Calculation Speed for 3-D Filling Process of the Castings;
对铸件三维充型模拟的计算速度研究
3.
Numerical Simulation of Filling and Solidification Process for Casting by Low-Pressure Casting;
低压铸造铸件充型凝固过程数值模拟
3) Mould Filling
充型
1.
Numerical Simulation for Large Thin-walled Plate Castings in Counter-gravity Mould Filling;
薄壁大平板铸件的反重力充型数值模拟
2.
Experiments and computer simulation for thin plate mould filling in high pressure with flowing water;
薄板型腔高压充型行为的水流与计算机模拟
3.
The mathematics model was established with coupling between the momentum, mass and energy transfer on the basis of the fluidity features of molten steel during mould filling.
在充分考虑浇注充型阶段钢液流动性特点的基础上,耦合动量传递、质量传递以及能量传递建立数学模型。
4) filling process
充型
1.
Water simulation study on filling process with vertical split gating system;
垂直缝隙式浇注系统充型过程水模拟
2.
Modeling of Filling Process with Gas-liquid Two-phase Based on Level Set Method;
基于Level Set法铸造充型过程气-液两相流数值模拟
3.
Mold filling processes are very important for the quality of castings.
铸造充型过程对铸件质量的影响很大，文中对流体充型过程的数值模拟做了研究。
5) mold-filling
充型
1.
Effect of traveling magnetic field on mold-filling capacities for E model castings of aluminum alloys;
移动磁场对铝合金E型铸件充型能力的影响
2.
The numerical simulation software ViewCast was used to analyze the mold-filling and solidification stages of thin-wall aluminum alloy casting in low-pressure casting process.
利用ViewCast软件研究了薄壁铝合金筒状铸件的低压铸造充型凝固过程,获得了低压铸造过程中温度场、流动速度场的分布。
6) model of filling
充型模型
补充资料：铜粉充填型导电胶
分子式：
CAS号：
性质：以铜粉作为导电粒子添加到胶黏剂中制得的导电胶。铜粉价格较便宜，在空气中易被氧化，稳定性较差，只能使用在要求不很高的产品上。一般电阻率在10-3Ω·cm数量级。
CAS号：
性质：以铜粉作为导电粒子添加到胶黏剂中制得的导电胶。铜粉价格较便宜，在空气中易被氧化，稳定性较差，只能使用在要求不很高的产品上。一般电阻率在10-3Ω·cm数量级。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条