1) plating rate
镀速
1.
Effects of compound chemical plating Ni-P-graphite on plating rate;
复合化学镀Ni-P-石墨工艺对镀速的影响
2.
The influences ofρ(Cr3+),ρ(additive),ρ(H 3 BO3),φ(complexant)and pH value on bath's covering power and plating rate,of plating time on plating rate and deposit thickness were studied respectively.
分别探讨了ρ(Cr3+)、ρ(添加剂)、ρ(H3BO3)、φ(络合剂)和pH对镀液覆盖能力和镀速,电镀时间对镀速和镀层厚度的影响。
3.
SEM photos obtained with the three processes were analyzed,and the effects of several additives such as thiourea,potash iodate,potassium nitrate and lead ion on bath stability and plating rate were studied.
采用了两种不同的酸蚀-活化工艺以及一种碱性预镀镍工艺作为铝合金化学镀镍的前处理工艺,分析了获得的SEM照片,比较了常用稳定剂硫脲、KIO3、KNO3、Pb2+对镀液稳定性及镀速的影响。
2) deposition rate
镀速
1.
Studies on deposition rate of electroless nickel-phosphorus alloy plating;
化学镀镍磷合金镀速的研究
2.
The effects of various compound stabilizers on the stability and deposition rate of the plating bath,and the porosity,corrosion resistance,and adhesion of the electroless Ni-P alloy coatings were investigated,which was aiming at development of the combined stabilizers suitable to the electroless Ni-P plating.
06个/cm2,耐浓硝酸时间为171 s,镀速为18。
3.
The effects of nickel salt concentration,tin salt concentration,reductant concentration,complexing agent concentration,temperature and pH on the deposition rate and deposit quality of electroless Ni-Sn-P alloy plating were discussed.
介绍了近年来国内外在化学镀Ni-Sn-P合金镀层方面的研究进展,探讨了镍盐含量、锡盐含量、还原剂含量、络合剂含量、温度和pH等因素对化学镀Ni-Sn-P合金的镀速及镀层质量的影响。
3) Plating speed
镀速
1.
Among a few low temperature formlae, a technical formula of good performance in plating speed,corrosion-resistance, etc, was selected; and an oplimum complexing compound was found.
通过对比低温环境下几个配方工艺,提出了一个在镀速、耐蚀性等方面均表现较好的工艺配方,同时发现了一种有优越作用的复合配合剂。
2.
The results show that a suitable amount of RE makes plating speed higher and plating bath stable;RE can deposit with Ni,P particles,play a role of micro-alloying and form the electroless coating with RE.
结果表明,镀液中加入适量的稀土氧化物能提高镀速、稳定镀液;稀土能与Ni、P粒子共沉积,起微合金化作用,形成含RE的化学镀层。
4) electrodeposition rate testing
镀速检测
5) high speed electroplating
高速电镀
1.
To search for a high speed electroplating Sn and Sn alloy technology with low cost, low corrosive and low pollution, the Sn and Sn\|Cu alloy coatings were deposited on copper wire of 0.
为了寻找低成本、低腐蚀、低污染高速电镀锡、锡铜合金工艺 ,在含光亮剂、柔软剂DL0 1、0 2、0 3的硫酸槽中在不同的电流密度、不同的搅拌速度下 ,在Φ0 。
6) fast zinc-electroplating
快速镀锌
补充资料：笃速速
1.亦作"笃簌簌"。 2.战抖貌。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条