1) Electroless Ni-Q plating bath
化学镀Ni-P镀液
2) electroless Ni-P plating wastewater
化学镀Ni-P废液
1.
The electroless Ni-P plating wastewater was treated by chemical coagulation process to determine the optimal technological conditions.
采用化学混凝方法对化学镀Ni-P废液进行处理,以确定最佳工艺条件。
3) electroless Ni-P plating
化学镀Ni-P
1.
Study of electroless Ni-P plating on the diamond;
金刚石表面化学镀Ni-P的研究
2.
The low temperature bonding between 95%Al2O3 ceramics and 45 steel was realized through first electroless Ni-P plating on Al2O3ceramic blocks and then soldering them to steel blocks with a low melting point filler metal of 63Sn-34Pb-2Ag-1Bi alloy.
采用化学镀Ni-P膜法金属化Al2O3陶瓷,并用63Sn-34Pb-2Ag-1Bi钎料膏实现了95%Al2O3陶瓷与45钢之间的低温钎焊。
4) Ni-P electroless plating
Ni-P化学镀
1.
The reaction mechanisms of Ni-P electroless plating and Ni-P-SiC composite electroless plating are researched, and the reaction thermodynamics are analyzed.
本文论述了Ni-P化学镀和Ni-P-SiC复合化学镀的反应机理,并对化学镀反应的热力学和动力学进行了分析。
2.
Ni-P electroless plating was adopted to encapsulate the as-received CaF2 in the preparation of precursor mixed powders of NiCr-Cr3C2-40%CaF2(wt.
%)复合合金粉末为原料,采用Nd:YAG激光熔覆技术,在γ-TiAl合金基体表面成功制备出了高温自润滑耐磨复合材料涂层,在复合粉体准备时,采用Ni-P化学镀包覆原始CaF2颗粒,以减少其在激光熔覆过程中的分解、蒸发和上浮。
5) electroless plating Ni-P
化学镀Ni-P
1.
In order to improve the deposition rate and anti-corrosion properties of electroless plating Ni-P on aluminum,effects of stabilizing agents and surface active agents on the deposition rate and corrosion resistance of electroless plating Ni-P were studied.
为了改善铝基体上化学镀Ni-P存在的镀速慢、镀层腐蚀性能差等问题,研究了稳定剂和表面活性剂对铝化学镀Ni-P镀层的沉积速度、硬度、孔隙率、结合力、耐蚀性、腐蚀电位、表面形貌等性能的影响。
2.
In order to improve the corrosion resistance of ZL101A alloy, the electroless plating Ni-P coatings with and without electroplating Cu layer were investigated by potentiodynamic polarization, salt spary test, SEM, microhardness meter.
为提高ZL101A合金的耐蚀性能,可直接化学镀Ni-P或电镀Cu后化学镀Ni-P在其表面施加镀层。
6) electroless Ni-P
化学镀Ni-P
1.
In order to improve the corrosion resistance of A356 alloy,electroless Ni-P coatings were plated on the A356 alloy with and without a Ni pre-electroplating and then their corrsion performance was investigated by potentiodynamic polarization,salt spary test,SEM and microhardness.
用直接化学镀Ni-P和先电镀Ni后化学镀Ni-P两种方法在A356合金表面施加镀层。
2.
Electroless Ni-P has been widely used in the microelectronic packing in the recent years because of the better solderability and diffusion barrier.
化学镀Ni-P是一种优异的钎焊阻挡层材料,具有良好的可焊性,近年来在微电子封装工业中得到了广泛的应用。
补充资料：花镀
花镀 古代鎏金工艺的一种。汉代已有使用，满城汉墓出土车饰中有一银当胪，就使用了花镀工艺。所谓“花镀”，即在同一饰物上，有的部分镀金，有的部分镀银，故称花镀。金银相间，黄白相映，艺术效果分外华丽。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条