1) solderability
[,sɔldərə'biləti]
钎焊性
1.
The reasons of lower solderability and spreading rate of molten lead free solders on copper base metal have been discussed from thepoint of view of phase relations and phase reactions.
从熔融钎料与母材的相关系和相反应(phase relation and phase reaction)出发,讨论了无铅钎料在铜上铺展率和钎焊性低下的原因,认为是其间过度和过于快速的金属间化合物生长所致。
2.
The test results show that the modifying solder has good solderability,whereas,the excellent flux is rosin-ethanol or rosin-isopropanol solution.
在熔融状态下无铅焊料合金的行为是影响电子产品微连接钎焊性的关键因素。
3.
The influences of cathode current density, pH value, and temperature on the performance of the coating were investigated, while the correlation among the Cr content in the plating and the corrosion resistance and solderability was explored.
以工业级的革鞣剂和硫酸镍为主盐,研究了硫酸盐体系电镀铬镍合金工艺配方与工艺规范、阴极电流密度、pH值、温度对镀层的影响,讨论了镀层中的铬含量对镀层耐腐蚀性和钎焊性的影响。
2) Brazability
钎焊性
1.
Improvement of joint brazability of aluminum alloys to stainless steel in the air
铝合金与不锈钢大气钎焊性的改善——铝合金与不锈钢焊接技术(二)
2.
Under torch brazing condition, using brazing filler metals of Cu-based and Ag-based, a series of tests are investigated to braze Ti(C,N) based cermets and 45 steel, the micrographic structure of joints and shearing test results are analyzed, they show that Ti(C,N) based cermets has good brazability.
通过观察和分析钎焊接头的结合情况及剪切试验 ,表明 Ti(C,N)基金属陶瓷具有较好的钎焊性 ;火焰钎焊条件下 ,以 H 6 2为钎料的接头的平均剪切强度为37MPa,以 BAg10 Cu Zn为钎料的接头的剪切强度达 114 MPa,以 BCu Zn Mn为钎料的接头的平均剪切强度为 4 9MP
3) active brazing
活性钎焊
1.
Interfacial reaction of active brazing between Al_2O_3 ceramic and metal Ni
Al_2O_3陶瓷与金属Ni活性钎焊界面反应
2.
Thermal cycle resistance of Al2O3/Ni-Ti/Kovar joints was studied, which were prepared by active brazing technique.
对采用活性钎焊的Al2O3/Ni-Ti/Kovar(可伐)接头进行了考察,实验结果显示,接头经热循环后强度异常增加。
3.
The active brazing of ceramics(Al_2O_3,ZrO_2andSi_3N_4)to ceramics and to 18-8 stainless steel was performed using Ag-Cu-Ti filler in a vaccum.
研究了Ａｌ＿２Ｏ＿３、９３％Ａｌ＿２Ｏ＿３、Ｓｉ＿３Ｎ＿４和ＺｒＯ＿２陶瓷与陶瓷、陶瓷与不锈钢活性钎焊。
4) Solderability
[,sɔldərə'biləti]
钎焊性能
1.
The solderability of electronic solders depends to a great extent on the wettability, which relates to solid, liquid and gas interfacial tensions of the melted solders on substrates.
钎料的钎焊性能很大程度取决于钎料对基板上的润湿性能,而润湿性能与液态钎料在基板上的液、固、气三相界面的界面张力有关。
2.
The effect of the content of copper on melting point,strength,solderability is emphatically discussed.
着重讨论了微量Ｃｕ含量对Ｚｎ－Ａｌ钎料熔点、强度、钎焊性能等的影响。
3.
The solderability of electronic solders and some factors that influence the solderability are discussed.
讨论了电子软钎料的钎焊性能及其影响因素,钎料的钎焊性能很大程度取决于钎料对基板的润湿性能,而润湿性能与液态钎料在基板上的液、固、气三相界面张力有关。
5) brazing characteristics
钎焊特性
1.
Vacuum brazing characteristics of Ni(80- x)Cr10B2.
5Fe3Cux合金钎料真空钎焊1Cr18Ni9Ti的钎焊特性,并对铜的影响进行了探讨。
6) vacuum brazing / active brazer
真空钎焊/活性钎料
补充资料：连续性与非连续性(见间断性与不间断性)
连续性与非连续性(见间断性与不间断性)
continuity and discontinuity
11an父ux泊g四f“山。麻以角g、.连续性与非连续性(c。nt，n琳t:nuity一)_见间断性与不间断性。and diseo红ti-
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条