The low temperature bonding between 95%Al2O3 ceramics and 45 steel was realized through first electroless Ni-P plating on Al2O3ceramic blocks and then soldering them to steel blocks with a low melting point filler metal of 63Sn-34Pb-2Ag-1Bi alloy.

Process of electroless copper plating on Al_2O_3 ceramics and its soldering at low temperature;

In this paper, a numerical simulation of thermal process on the SMT laser microsoldering joint has been developed, in which, the influence on thermal process of the factors such as the thermal conductivity, variation of solder with temperature, light reflection coefficient of the lead wire surface, and heat exchange on the surface of SMT materials have all been considered.

Electron beam brazing temperature field PID control system;

Effect of processing parameters including brazing temperature and holding time on the joint mechanical property was also discussed by optical microscope,SEM and EDS.

The effects of brazing temperature and time on the structure and property of the brazed joint between graphite and TZM alloys with Ti-based filler in vacuum were presented.