1) SU-8 photoresist
SU-8胶
1.
Study on dimensional precision of UV-lithography on SU-8 photoresist;
SU-8胶紫外光刻的尺寸精度研究
2.
With the application of neural network,process parameters of negative SU-8 photoresist were optimized in terms of internal stress.
根据基片曲率法的原理,通过三因素三水平的正交实验,测量了9组不同工艺条件下SU-8胶层内应力的大小。
3.
Thermal swelling of SU-8 photoresist and its mechanism were investigated.
对SU-8胶的热溶胀效应及其机理进行了研究,在现有微模具的UV-LIGA工艺的基础上,利用AN-SYS对SU-8胶的热溶胀性规律进行了仿真分析。
2) SU-8 resist
SU-8胶
1.
The development process of the high resolute and high aspect ratio microstructure with SU-8 resist on the metal substrate was discussed, and the development rule of resist with different graphic feature and thicknesses from 120-340 μm was analysed.
突破了传统深宽比概念,提出金属基底上基于图形特征的光刻胶显影技术,对采用SU-8胶加工高分辨率和高深宽比微结构的显影工艺进行了讨论,分析了120～340μm厚具有不同图形特征的SU-8胶显影规律,认为在同样条件下,凸型图形显影效果优于凹型非连通性图形;曲线型显影效果优于直线型图形与点状图形;圆弧连接的图形显影效果优于尖角型图形。
2.
In this paper,UV-LIGA technology was investigated to fabricate the ultra-high micro electrode array,and the micro electrochemical machining was used as an aided method to remove the SU-8 resist.
采用UV-LIGA技术制作超高金属微细阵列电极,并利用电解置桩的方法辅助去除SU-8胶。
3) SU-8 removal
SU-8去胶
4) SU-8 Thick Photoresist
SU-8厚胶
1.
Fabrication and Dimensional Control of Nickel Mould Based on SU-8 Thick Photoresist Techniques;
基于SU-8厚胶镍模具制作及其尺寸精度控制研究
5) SU-8 photoresist
SU-8光刻胶
1.
Three-dimension photonic crystals fabrication using SU-8 photoresist;
SU-8光刻胶制作三维光子晶体
2.
Effect of post exposure bake temperature on thermal swelling of SU-8 photoresist;
后烘温度对SU-8光刻胶热溶胀性及内应力的影响
3.
By the method,the nickel micro-electroforming pattern was directly made on a metal substrate by a low-cost UV-LIGA surface micro-fabrication process using the negative thick SU-8 photoresist to form the microinjection mold.
介绍了一种新颖的微注塑模具的制作方法———无背板生长法,它是利用负性厚SU-8光刻胶,通过低成本的UV-LIGA表面微加工工艺,直接在金属基板上电铸镍图形而制作完成的。
6) SU-8 photoresist mold
SU-8胶印模
1.
Processes of SU-8 photoresist mold and polymer elastomeric stamp were researched in order to solve the technology of the key part—elastomeric stamp in the soft-lithography.
为了解决软光刻技术中核心元件弹性印章的制备技术,对SU-8胶印模和聚合物弹性印章进行了工艺研究。
补充资料：Su
分子式 C4H4O3
分子量 100.07
CAS号 108-30-5
琥珀酸酐为白色斜方形棱状结晶。熔点119.6℃。相对密度d204=1.2340。溶于乙醇、氯仿和四氯化碳,微溶于水和乙醚。其沸点随压力不同而变化。
用途;琥珀酸酐是重要的有机合成中间体。在医药工业上主要用于合成氯霉素琥珀酸酯钠（Chloramphenicol sodium succinata)、羟孕酮琥珀酸酯钠、氢化可的松琥珀酸酯钠等。
分子量 100.07
CAS号 108-30-5
琥珀酸酐为白色斜方形棱状结晶。熔点119.6℃。相对密度d204=1.2340。溶于乙醇、氯仿和四氯化碳,微溶于水和乙醚。其沸点随压力不同而变化。
用途;琥珀酸酐是重要的有机合成中间体。在医药工业上主要用于合成氯霉素琥珀酸酯钠（Chloramphenicol sodium succinata)、羟孕酮琥珀酸酯钠、氢化可的松琥珀酸酯钠等。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条