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1)  diamond thick film
金刚石厚膜
1.
Large area diamond thick film deposited by HFCVD;
热丝CVD法制备大面积金刚石厚膜
2.
Effect of substrate temperature on depositing quality of diamond thick film;
基体温度对金刚石厚膜沉积质量的影响
3.
A new technology for manufacturing CVD diamond thick film cutters is presented.
提出一种制作CVD金刚石厚膜焊接刀具的新工艺。
2)  diamond thick films
金刚石厚膜
1.
Study on the influence of growth temperature on the deposition of diamond thick films by MPCVD;
基片温度对金刚石厚膜生长的影响
2.
Investigation on grain boundaries and related abradability of diamond thick films;
金刚石厚膜的晶界对耐磨性的影响
3.
Preparation of free-standing diamond thick films of large area and high quality using hot-filament CVD method
热丝CVD法制备大面积高质量自支撑金刚石厚膜
3)  thick diamond film
金刚石厚膜
1.
These indicate that copper is an ideal substrate for the preparation of thick diamond films.
因此铜是制备金刚石厚膜的理想基体材料。
2.
The thick diamond film (0 6 mm) has been synthesized by the combustion flame CVD.
用燃焰法进行了金刚石厚膜的沉积实验,制备了厚度约0。
4)  CVD diamond thick film
CVD金刚石厚膜
1.
Etching of CVD diamond thick films by rare-earth compound ink;
CVD金刚石厚膜的稀土化合物浆料刻蚀(英文)
5)  diamond thick film cutter
金刚石厚膜刀具
1.
The mechanically clamped diamond thick film cutter is prepared.
制备了机夹式金刚石厚膜刀具 ,通过切削试验研究了金刚石厚膜刀具精密车削LY12铝合金时切削用量 (进给速度vf、切削速度v和切削深度ap)对切削表面粗糙度的影
6)  FTDF
自持金刚石厚膜
1.
In this dissertation,Freestanding Thick Diamond Films(FTDF) prepared by CVD method are applied as substrates of piezoelectric materials and the piezoelectric films are investigated systematically.
本文以CVD方法制备的自持金刚石厚膜为基片,沉积压电薄膜并系统研究了压电薄膜的各项性能。
补充资料:金刚石膜
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性质:用低压或常压化学气相沉积(CVD)方法人工合成的金刚石膜。金刚石的硬度在固体材料中最高,达HV100GPa,热导率为100W·cm-l·K-1,为铜的5倍,禁带宽度为6.6~8.0eV,室温电阻率高达1016Ω·cm,通过掺杂可以形成半导体材料。金刚石在从紫外到红外广阔频带里都有很高的光学透射率,它还是一种优良耐腐蚀材料。金刚石膜的制备方法有热化学气相沉积(TCVD)和等离子体化学气相沉积(PCVD)两大类。现正在研究将研制得到的金刚石膜作耐磨涂层、声学膜片、光学窗口、集成电路高热导基片。还研究在硅片上外延单晶金刚石膜,以制备金刚石器件。

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