1) epoxy adhesive
环氧胶
1.
Modification of curing agent and accelerator for one component epoxy adhesive;
单组分环氧胶固化剂及促进剂的改性研究
2.
Study on strengthen epoxy adhesive cured at high temperature with glass fibre;
玻璃纤维对高温固化环氧胶的增强作用研究
3.
Effect of silica on strength of epoxy adhesive;
SiO_2对环氧胶粘剂强度的影响
2) epoxy resin adhesive
环氧胶
1.
The epoxy resin adhesives composited with multi-walled carbon nanobutes(MWCNTs) curing at room temperatue were prepared by solution blend process using different diameter of CNTs and different weight percents of CNTs.
应用三辊研磨、超声等手段将多壁碳纳米管(MCNT)与CH6型室温固化环氧胶直接共混,制得了碳纳米菅环氧复合胶。
3) Epoxy resin
环氧胶
1.
A new epoxy resin hardener system was developed by hydroxymethyl reaction and Mannich reaction of fatty amine and mixture of catalyst.
采用活性稀释剂和无机碱性填料,可使低成本的糠叉丙酮改性环氧胶能在低温(0～5℃)固化,并且在潮湿或水下环境中具有较高的粘接强度和抗压强度,加入适当的有机硅可使其具有较低的吸水性。
2.
Using the silver paste and epoxy resin as die bonding materials, two kinds of power LEDs are made.
分析了功率型LED热阻系统的构成,对采用银浆和环氧胶作为芯片键合材料的功率型LED热阻进行了对比研究。
4) epoxy silica gel
环氧硅胶
1.
In the concentrated sulfuric acid conditions, silica gel confined ionic liquids could be prepared by the reaction of N-methylimidazoe with alkyl epoxy silica gel, which was synthesized by silica gel as solid support and KH-560 as the coupling agent.
以硅胶为载体,KH-560为偶联剂合成了烷基硅烷化环氧硅胶,再与N-甲基咪唑在浓硫酸作用下制备硅胶固定化离子液体。
5) epoxy film adhesive
环氧胶膜
1.
Study on one-component epoxy film adhesive curable at moderate temperature;
中温固化单组分环氧胶膜的研究
6) epoxy adhesive
环氧胶层
补充资料：DAD导电环氧胶
分子式：
CAS号：
性质：是以环氧树脂、固化剂、增韧剂和导电银粒子配制成的导电胶黏剂，可以分成单组分型和多组分型，根据固化温度还可以分成室温固化胶、中温固化胶和高温固化胶。银粒子抗氧化能力强，制成的导电胶稳定性较好。其电阻率在(1～5)×10-4Ω·cm之间。广泛用于各种电子设备中电子器件的胶接。
CAS号：
性质：是以环氧树脂、固化剂、增韧剂和导电银粒子配制成的导电胶黏剂，可以分成单组分型和多组分型，根据固化温度还可以分成室温固化胶、中温固化胶和高温固化胶。银粒子抗氧化能力强，制成的导电胶稳定性较好。其电阻率在(1～5)×10-4Ω·cm之间。广泛用于各种电子设备中电子器件的胶接。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条