1) sputtering
[英]['spʌtə] [美]['spʌtɚ]
溅射
1.
XPS study of Ni_(49.54)Mn_(29.59)Ga_(20.87) magnetically driven shape memory alloy thin film fabricated by D.C magnetron sputtering technique;
直流磁控溅射Ni_(49.54)Mn_(29.59)Ga_(20.87)磁驱动记忆合金薄膜的XPS研究
2.
Growth and characterization of aluminum nitride films by penning-type discharge plasma sputtering process;
潘宁放电溅射沉积纳米级AlN薄膜的性质
3.
Growth of TiN Film by Modified Ion Beam Enhanced Magnetron Sputtering;
气离溅射离子镀制氮化钛
2) sputter
[英]['spʌtə(r)] [美]['spʌtɚ]
溅射
1.
Cu films sputtered with applied magnet under substrate and their microstructures;
基片下磁场中溅射镀铜薄膜及其微结构
2.
Zinc Oxide Thin Films Prepared Using Microwave ECR Plasma Sputtering Method;
微波电子回旋共振等离子体溅射法沉积ZnO薄膜
3.
Study of TiN Thin Film by Microwave ECR Plasma Reaction Sputtering Deposition;
微波ECR等离子体溅射沉积TiN薄膜的研究
3) Sputtered
[英]['spʌtə] [美]['spʌtɚ]
溅射
1.
In order to improve appearance and hydrophobicity of waterproof and moisture permeable coatings, the yellowish of sputtered polymeric fluorocarbon films was investigated.
为改善射频溅射法制备的防水透湿涂层的外观和拒水性 ,对涤纶织物基底上的溅射氟碳高分子膜的泛黄问题进行了研究。
2.
By means of the Monte-Carlo simulation based on the binding collision approximation,this paper investigates the sputtering of Silver and Cadmium element targets bombarded by 27 keV Ar+ ions and studies the spatial distribution of sputtered atoms by collision cascade.
用蒙特卡罗方法模拟能量为２７ｋｅＶＡｒ＋轰击Ａｇ和Ｃｄ单元素靶的力学运动，以研究级联碰撞产生的溅射原子的空间分布情况，对计算结果进行适当的数学处理，以得出微分溅射产额角分布。
3.
The XRD patterns of SnO2 thin film sputtered with different methods are compare 1 for their difference in the field of structure.
本文采用三种不同的溅射方法制备具有纳米尺度的SnO2薄膜,针对溅射方式的不同,结合薄膜结构上的差异,对三种溅射方式制备的SnO2薄膜进行了XRD分析比较。
4) spattering
[英]['spætə(r)] [美]['spætɚ]
溅射
1.
However the waterfall model can not simulate the waterfall effect very well and the system lacks proper model to represent the spattering of stream.
对瀑布起点和终点的波特别处理,表现出水的流动效果,同时增加了溅射模型,使系统能够更好地模拟出一般障碍物,以及正面大的障碍物溅水等常见的动画场景。
2.
The preparation of ZnO film using two methods of spattering is also presented.
还介绍了两种溅射方法制备ZnO薄膜。
5) RF sputtering
射频溅射
1.
Influence of target self-bias in inverted cylindrical RF sputtering on the microstructure and electrical properties of Ba_(0.65)Sr_(0.35)TiO_3 thin films;
倒筒式射频溅射自偏压对Ba_(0.65)Sr_(0.35)TiO_3热释电薄膜结构及性能的影响
2.
Study of 3C-SiC and 4H-SiC films deposited using RF sputtering method;
射频溅射法制备3C-SiC和4H-SiC薄膜
3.
Nanocrystalline TiO_2 thin films were prepared by reactive RF sputtering, then the samples were treated by Ar radio frequency plasma.
用反应射频溅射法在导电玻璃上制备TiO2薄膜,并用Ar射频等离子体对TiO2薄膜进行处理。
6) radio frequency sputtering
射频溅射
1.
Preparation of cubic boron nitride films by radio frequency sputtering;
用射频溅射法制备立方氮化硼薄膜
补充资料：溅射
分子式：
CAS号：
性质：以荷能粒子(常用气体正离子)轰击某种材料的靶面，而使靶材表面的原子或分子从中逸出的现象。利用它可使他种基体材料表面获得金属、合金或电介质薄膜。常见的有阴极溅射(直流溅射)、反应溅射、偏压溅射及射频溅射等，种类颇多。溅射薄膜通常是在惰性气体(如氩)的等离子体中制取。采用溅射工艺具有基体温度低，薄膜质纯，组织均匀密实，牢固性和重现性好等优点。适用于制造薄膜集成电路、片式引线器件和半导体器件等用。
CAS号：
性质：以荷能粒子(常用气体正离子)轰击某种材料的靶面，而使靶材表面的原子或分子从中逸出的现象。利用它可使他种基体材料表面获得金属、合金或电介质薄膜。常见的有阴极溅射(直流溅射)、反应溅射、偏压溅射及射频溅射等，种类颇多。溅射薄膜通常是在惰性气体(如氩)的等离子体中制取。采用溅射工艺具有基体温度低，薄膜质纯，组织均匀密实，牢固性和重现性好等优点。适用于制造薄膜集成电路、片式引线器件和半导体器件等用。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条