1.
Mechanism and Process of Cu-Sn Bonding for Wafer Level MEMS Packaging
MEMS圆片级封装用Cu-Sn低温键合机理与工艺研究
2.
Cu/Sn Isothermal Solidification Technology for Wafer-level Hermetic Packaging of MEMS;
Cu/Sn等温凝固键合技术在MEMS圆片级气密封装中的应用
3.
Research on the thermal stress and warpage of WLCSP device
晶圆尺寸级封装器件的热应力及翘曲变形
4.
round-slice sealed porcelain condenser
圆片包封瓷介电容器
5.
Integration and Packaging of Sensors and MEMS Devices Through Low Temperature Wafer Bonding
用低温圆片键合实现传感器和微电子机械系统器件的集成和封装
6.
By using FC or COB, die products are mounded in the MCM.
这些芯片级产品可以以fc方式或COB方式安装在封装体中。
7.
A single piece of semiconductor material that has been cut from a slice by scribing and breaking.It can contain one or more circuits but is packaged as a unit.
将半导体大圆片分割而成的小片。它可有一个或多个电路，但作为一个单位封装而成。
8.
phonograph records were sold in cardboard jackets.
唱片装在封套里出售。
9.
A round medicinal preparation, such as a large pill or tablet, that is usually of a soft consistency and not prepackaged.
大药丸圆形药物制剂，如大药丸或大片剂，常用于软的粘稠制剂，不预先封装
10.
the seal of the air-balancing cylinder adopts multi-stage seal;
气平衡缸密封部位采用多级密封装置 ;
11.
Comprehensive Comparison Between FC and CSP and Their Development Anticipation
倒装片封装与芯片规模封装的综合比较及其发展前景
12.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
13.
Flip Chip will be a New Method of Packaging Technology
倒装芯片将成为封装技术的最新手段
14.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术
15.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
16.
This card just fits nicely into that envelope.
这张卡片正好能装进那个信封里.
17.
Research on welding fault during LED chips packaging
LED芯片封装工艺中焊接缺陷研究
18.
Thermal Stress Analysis and Optimization of SCSP Chip Package
叠层CSP芯片封装热应力分析与优化