1.
The Method and Device of Dual-Beam Laser Lane Designated Slot for Solar Silicon Chip;
太阳能硅晶片双束激光双线划槽方法与装置
2.
Monocrystalline silicon ascut slices and lapped slices
GB/T12965-1996硅单晶切割片和研磨片
3.
The Czochralski silicon monocrystalline polished wafer with a diameter of eight inches
8英寸直拉硅单晶抛光片
4.
Now people can produce a wafer silicon.
现在人们能够生产一种硅晶薄片。
5.
International Standard - Grain-Oriented Electrical Steel Silicon Steel Sheet for Electrical Use
晶粒取向电器用硅钢片主要工业标准
6.
A Simulant Experiment Study of the Silicon s Mechanism in the CMP;
单晶硅片CMP磨损机理的模拟试验研究
7.
Material removal characteristic of silicon wafers in chemical mechanical polishing
单晶硅片化学机械抛光材料去除特性
8.
Crystallographic Features Study of Polycrystalline Silicon Ingot for Solar Cells
用于太阳能电池的多晶硅锭片晶体学特征研究
9.
Magnetic and Electrical Properties of SI-ORIENT-CORE-HI-B-LS
晶粒取向电器用硅[硅]钢;片-高硼低硫定取向钢片之磁力及电力性能
10.
Bonded Wafers- Two silicon wafers that have been bonded together by silicon dioxide, which acts as an insulating layer.
绑定晶圆片-两个晶圆片通过二氧化硅层结合到一起，作为绝缘层。
11.
The Research of Power Quality by Improve the Wafer Efficiency of the Monocrystalline Silicon Solar Cell
单晶硅太阳能电池硅片转换效率提高对并网电能质量的改善
12.
Method for measuring crystallographic orientation of flats on single crystal silicon slices and wafers by X-ray techniques
GB/T13388-1992硅片参考面结晶学取向Ｘ射线测量方法
13.
The processing characteristics and some material properties of silicon wafers depend on the orientation.
硅片的工艺性质与某些材料特性均与晶向有关。
14.
Study on the Surface Layer Damage of Monocrystalline Silicon Wafer Induced by Ultra-precision Grinding;
单晶硅片超精密磨削加工表面层损伤的研究
15.
Experimental Research on Ultra-precision Grinding Technology for Silicon Wafer Thinning
单晶硅片超精密磨削减薄技术试验研究
16.
Prediction and Measurement of Subsurface Damage Thickness of Silicon Wafer in Wire Saw Slicing
单晶硅线锯切片亚表层损伤层厚度预测与测量
17.
INFLUENCE OF FIRING PROCESS ON BOW OF THIN MONOCRYSTALLINE SILICON WAFERS FOR SOLAR CELLS
烧结工艺对薄片单晶硅太阳电池弯曲的影响
18.
Study on the Machining Performance of Single Crystal Silicon Wafer Cut by Using Reciprocating Electroplated Diamond Wire Saw
往复式电镀金刚石线锯切割单晶硅片特性研究