1.
The Bonding Structure Optimizing Design and Experimental Study for Die Bonder;
粘片机焊头机构优化设计及实验研究
2.
Moving Stiffness Analysis on the Parallel Bonding Mechanism of IC Chip Die;
IC芯片粘片机并联焊头机构的动刚度分析
3.
The Study of Picking-Route Algorithm on the Wafer of Thick-Film LED Bonder;
厚膜LED粘片机晶圆拾取路径方法研究
4.
Multidomain Unified Modeling and Simulation of Die Bonder;
芯片粘片机多领域统一建模与仿真分析
5.
Analysis of Kinematics and Dynamics and Experimental Research for Parallel Bonder of IC Die Bonder;
IC芯片粘片机并联焊头机构的运动学动力学分析及实验研究
6.
Detection of Plasm Viscosity Base on Time of Atmega168
AVR单片机在血浆粘度测量中的应用
7.
The Computer on Slice Controlling System of Liquid Coefficient Viscosity on Line;
液体动力粘度在线单片计算机控制系统
8.
Preparation and Application on Heat-Resisting Inorganic Adhesive Used for CFRP Laminate-Strengthening;
粘贴CFRP片材用耐高温无机胶的制备及应用研究
9.
Research of Improving Adhesion Strength Between Polyurethane Interlayer and Directional PMMA Plate
聚氨酯胶片与有机玻璃界面粘结强度的研究
10.
Single-chip Microcomputer-based Control System for Cone and Plate Blood Viscometer
基于单片机的锥板式血液粘度仪的控制系统
11.
The machine is a special purpose equipment with carton gluer, it can be gluer corrugated paperboard with3- layer,5- layer or7- layer.
本机为纸箱粘合成形的专用设备，能够对三层、层、层瓦愣箱片进行粘合。
12.
Research on Sticking Failure Mechanism and Failure Criterion for Milling Insert with 3D Groove;
三维复杂槽型铣刀片粘结破损机理及破损判据的研究
13.
The Numerical Study of Three Dimensional Viscous Flow of Multi-Blade Rows in Turbomachinery;
叶轮机械多叶片排三维粘性流动计算方法的研究
14.
The Study of the Protection Mechanism of JNKSTⅢ on Cerebral Ischemia-reperfusion Injury in Rats
降粘抗栓片Ⅲ号对大鼠脑缺血再灌注损伤的保护机制研究
15.
Mechanism of the Effect of Adhesive Co on the Thermal Stability of Polycrystalline Diamond Compact
粘结剂钴对于聚晶金刚石复合片热稳定性的作用机制
16.
To glue together(layers of wood)to make plywood.
把（木片层）粘合成胶合板
17.
Slices of orange with burnt honey.
粘了焦蜜的桔子片。
18.
The brass plate must be adherent to the steel.
黄铜片必须和钢粘结。