1.
tape bonded hybrid
带焊接的混合集成电路
2.
hybrid microassembly
混合集成电路微组装
3.
large scale hybrid integrated circuit
大规模混合集成电路
4.
Case outlines for film integrated circuits and hybrid integrated circuits
GB/T15138-1994膜集成电路和混合集成电路外形尺寸
5.
circuit, integrated hybrid, thin or thick film
混合集成电路,薄膜或厚膜的
6.
The Implementation of One-dimension Wavelet Transform Through Hybrid of Analog and Digital Circuit;
数模混合集成电路实现一维小波变换
7.
The Reliability-Analysis for HIC and Its Improvement;
厚膜混合集成电路可靠性分析与提高
8.
Application of Virtual Instruments Technique in HIC Testing;
虚拟仪器技术在厚膜混合集成电路测试中应用
9.
Reliability investigation on microvave HIC technologies under critical transition temperature of superconductor
超导温度下微波混合集成电路工艺可靠性初探
10.
Series and products of high frequency wideband amplifiers for hybrid integrated circuits used in cabled distribution systems
GB/T15295-1994电缆分配系统用混合集成电路高频宽带放大器系列和品种
11.
A New Conductor System Replaced Au with Cu Used in Hybrid Microwave Integrated Circuits
用于微波混合集成电路的新型以铜代金导电系统
12.
The Application of Infrared Imaging Technology on The Thermal Design of Thick Film Hybrid IC
热成像技术在厚膜混合集成电路热设计中的应用
13.
passive hybrid film integrated circuit
无源混合膜集成电路
14.
This is called a hybrid integrated circuit .
这称为混合型集成电路。
15.
Generic specification for film integrated circuits and hybrid film integrated circuits
GB/T8976-1996膜集成电路和混合膜集成电路总规范
16.
The Design of Mixed Signals Power Management Integrated Circuit XDJ6398;
数模混合电源管理集成电路XDJ6398的设计
17.
Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure
GB/T13062-1991膜集成电路和混合膜集成电路空白详细规范(可供认证用)
18.
Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
GB/T16465-1996膜集成电路和混合膜集成电路分规范（采用能力批准程序）