1.
Direct Chip Attachment Packaging of a 2-D Thermal Flow Sensor
采用芯片直接安装技术封装的风速风向传感器
2.
Thermal Design of High-Power LED Multi-Chip on Board Package
大功率LED多芯片基板上直接封装的热设计
3.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
4.
Research on welding fault during LED chips packaging
LED芯片封装工艺中焊接缺陷研究
5.
Effect of different adhesives on the evolution of residual stress at chip surface during and after curing for COB packages
粘接剂对直接粘贴芯片表面残余应力的影响
6.
Tubes of suit go back rotor iron chip with suit, cooperate with relevant equipment , realize iron core rivet automation.
用套装筒套装回转子铁芯片，配合相关设备，实现铁芯铆接自动化。
7.
The valve can be installed in horizontal or vertical. Add seal cushion between two flanges connection and screw down bolt.
本阀可水平或垂直安装，安装时两法兰连接中间必须加密封垫片，然后均匀锁紧螺栓。
8.
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
9.
The new chips will not have four cores on a single slice of silicon, but instead consist of two dual-core chips stuck together.
新的芯片将不会在单个硅片上安装四个内核，而是包含两个了2个组合在一起的双核芯片。
10.
By using FC or COB, die products are mounded in the MCM.
这些芯片级产品可以以fc方式或COB方式安装在封装体中。
11.
The Analysis of the Connection from BU-61580 To DSP
61580芯片与DSP芯片的连接关系分析
12.
Both eliminators and inlet baffles are normally installed in a vertical position.
挡水板和异流片通常都是垂直安装。
13.
SMT power inductor formed by directly connected electrode on ferrite core.
大功率表面贴装电感的电极组成是直接连接在磁芯上。
14.
chip on board process
基板上芯片装配工艺
15.
No devices capable of accepting direct connections are currently installed.
目前没有安装可以接受直接连接的设备。
16.
No devices capable of accepting direct connections are currently installed.\0
目前没有安装可以接受直接连接的设备。\0
17.
Slide the memory seat module off of the two mounting bracket slide tabs far enough to access and unplug the wire harness connectors.
将存储座位模组滑离两个安装支架滑式舌片，直至足以够着并拔下线束接头。
18.
film carrier bonding
膜形载体上芯片接合