1.
Development of a Miniature T/R Front-end Using Microwave Multi-Chip Module Technology
基于多芯片组装技术的小型微波收发前端研制
2.
Multi-chip Array Combination White Light LED Seal Research
多芯片阵列组合白光LED封装研究
3.
Performance of a silicon-based embedded MMCM package
一种硅埋置型微波多芯片组件封装的电性能
4.
Characteristics simulation of MEMS packaging using multichip modules technology
基于微机械系统的多芯片组件封装和特性模拟(英文)
5.
Patterning different cells based on microfluidics and self-assembled monolayers
一种基于微流控芯片和电化学自组装单层的多细胞表面构图方法
6.
Study on Thermal Placement Optimization of Stacked 3D-MCM Based on Thermal Superposition Model
基于热叠加模型的叠层3D多芯片组件芯片热布局优化研究
7.
Thermal Design of High-Power LED Multi-Chip on Board Package
大功率LED多芯片基板上直接封装的热设计
8.
The new chips will not have four cores on a single slice of silicon, but instead consist of two dual-core chips stuck together.
新的芯片将不会在单个硅片上安装四个内核，而是包含两个了2个组合在一起的双核芯片。
9.
Analysis of the Interconnect in Microwave Multi-chip Module by Parallel FDTD Technique;
并行FDTD技术分析微波多芯片组件的互连效应
10.
Warpage of Three-Dimensional Multi-Chip Module Based on Embedded Substrate
基于埋置式基板的三维多芯片组件的翘曲研究
11.
Construct cell immuno-chip with tissue microarray technique
应用组织芯片技术构建细胞免疫芯片
12.
chip on board process
基板上芯片装配工艺
13.
Chipsets are key components in computers and other electronic devices that act as nervous systems channelling data between CPUs and other chips.
芯片组是电脑和其它电子装置的关键部件，是CPU和其它芯片之间数据传输的中枢系统。
14.
SOAC System On a Chip
系统集成多功能芯片
15.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
16.
Flip Chip will be a New Method of Packaging Technology
倒装芯片将成为封装技术的最新手段
17.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术
18.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术