1.
Wettability and microstructure of multicomponent Cu-based active filler metal on c-BN
多元铜基活性钎料对c-BN的润湿性与微观组织
2.
Influence of Cu on Properties of Zn-Al Solders for Al/Cu Brazing
Cu元素对铝/铜钎焊用Zn-Al钎料性能的影响
3.
Characteristics of Amorphous Brazing Ribbon of Cu-P Based Alloy
非晶态铜磷钎料真空钎焊紫铜的性能
4.
spelter brazing alloy
铜锌基硬钎焊料合金
5.
Study on the new type soldering acid and filler metal for restoration of ancient bronze;
古代青铜器修复钎焊用钎剂与钎料的改性研究
6.
Microstructure,Mechanical Property and Interfacial Reaction of Sn-Cu Based Multicomponent Lead-Free Solders
Sn-Cu基多组元无铅钎料组织、性能及界面反应研究
7.
Investigation on Design and Properties of Cadmium-Free Copper-Based Intermediate Temperature Filler Metals
铜基中温无镉钎料的设计与组织性能分析
8.
Microstructure and Properties of Vacuum Brazing C_f/C Composites Using Reactive Al Based Filler Metals
铝基活性钎料真空钎焊C_f/C复合材料焊接接头的组织及性能
9.
A Study on the Active Brazing of AlN to W-Cu Alloy with Ag-Ti_4 Active Filler Alloy
Ag-Ti_4活性钎料钎焊AlN与W-Cu合金研究
10.
The Preparation and Research of the Al-Si-Cu-Sn-Zn Multi-Aluminum Solder
Al-Si-Cu-Sn-Zn多元铝基钎料的制备与研究
11.
Study on Cu-based Filler Metal Brazed Composite Coating with Particle Reinforced;
铜基钎料钎焊颗粒增强复合涂层的研究
12.
Effect of Alloy Element Addtion on IMC at the Soldering Interface of Sn-based Binary Solders;
合金元素对二元Sn基钎料钎焊界面IMC的影响
13.
Synthesis and Electrochemical Performance of Multi-element Tin and Copper Based Alloy Negative Materials;
锡铜基多元合金负极材料的制备及电化学性能
14.
Effect of Cu addition on Sn-9Zn lead-free solder properties
添加铜对Sn-9Zn无铅钎料性能的影响
15.
Weldability and Microstructure of Copper Joints Welded by Two Kinds of Phosphor-copper Brazing Filler Metal
两种铜磷钎料对紫铜钎焊的焊接性能和焊缝组织对比
16.
The Study on Mixture Design of Multiplex Sn-Zn System Lead-free Solder;
多元Sn-Zn系无铅钎料混料设计的研究
17.
Brazing of IC10 superalloy with Ni-based brazing fillers using Hf and Zr as melting-point depressants
Hf与Zr为降熔元素镍基钎料对IC10合金的钎焊
18.
Microstructure and properties of BCu80Ni5SnTi active filler metal for brazing cubic boron nitride
钎焊立方氮化硼BCu80Ni5SnTi活性钎料的组织与性能