1.
Challenges,Trends and Solutions for 3D Interconnects in Lithography and Wafer Level Bonding Techniques
三维互连中光刻及晶圆级键合技术的挑战、趋势和解决方案(英文)
2.
Critical Success Factors for High-Volume Wafer-level Solder Ball Placement
大规模晶圆级焊球置放关键的成功因素
3.
The Advances in Wafer Bonding and MEMS
晶圆键合技术与微电子机械系统新进展
4.
Mechanism and Process of Cu-Sn Bonding for Wafer Level MEMS Packaging
MEMS圆片级封装用Cu-Sn低温键合机理与工艺研究
5.
Cu/Sn Isothermal Solidification Technology for Wafer-level Hermetic Packaging of MEMS;
Cu/Sn等温凝固键合技术在MEMS圆片级气密封装中的应用
6.
Studies on the Design and Synthesis of Second Structure Driven by CH…O Hydrogen Bond in Crystal Growth;
晶体生长中基于CH…O弱氢键导向堆积的二级结构的设计与合成
7.
Research on the Key Technology of Servo Control System for the Wafer Transfer Robot
晶圆传输机器人伺服控制系统关键技术研究
8.
Influence of Silicon/Glass-ceramic Anodic Bonding Technology on Bonding Intensity
硅/微晶玻璃阳极键合工艺对键合强度的影响
9.
Research on the thermal stress and warpage of WLCSP device
晶圆尺寸级封装器件的热应力及翘曲变形
10.
Bonded Wafers- Two silicon wafers that have been bonded together by silicon dioxide, which acts as an insulating layer.
绑定晶圆片-两个晶圆片通过二氧化硅层结合到一起，作为绝缘层。
11.
Bonding Interface- The area where the bonding of two wafers occurs.
绑定面-两个晶圆片结合的接触区。
12.
Investigation of the Glass-ceramics Used for Anodic Bonding Material in MEMS;
MEMS封装用静电键合微晶玻璃的研究
13.
Research of GaAs/InP Wafer Bonding Technology;
GaAs/InP晶片键合技术的研究
14.
ELECTRICAL PROPERTIES OF Li_2O-Al_2O_3-SiO_2 GLASS-CERAMICS USED AS ANODIC BONDING MATERIAL
阳极键合用Li_2O-Al_2O_3-SiO_2微晶玻璃电学性能
15.
Simulation of drum mixer system vibration based on power bond graph
基于键合图的圆筒混合机系统的振动仿真
16.
Preparation and Characterization of a Series of Intermolecular Hydrogen Bonded Liquid Crystalline Complexes
一系列氢键诱导液晶复合物的合成及表征
17.
Synthesis and Crystal Structure of 2D Hydrogen-Bonded Magnesium(Ⅱ) Complex
2D氢键网状Mg(Ⅱ)配合物的合成和晶体结构
18.
Synthesis and Characterization of Intermolecular Hydrogen Bond Induced Supermolecular Liquid Crystalline Compound
氢键自组装超分子液晶复合物的合成及表征