1.
The RF Wafer Test Technology with SoC Tester
基于SoC测试系统的RF圆晶片测试技术
2.
Mechanical Test Wafer- A silicon wafer used for testing purposes.
机械测试晶圆片-用于测试的晶圆片。
3.
Process Test Wafer- A wafer that can be used for processes as well as area cleanliness.
加工测试晶圆片-用于区域清洁过程中的晶圆片。
4.
Virgin Test Wafer- A wafer that has not been used in manufacturing or other processes.
原始测试晶圆片-还没有用于生产或其他流程中的晶圆片。
5.
Particle Counting- Wafers that are used to test tools for particle contamination.
颗粒计算-用来测试晶圆片颗粒污染的测试工具。
6.
Premium Wafer - A wafer that can be used for particle counting, measuring pattern resolution in the photolithography process, and metal contamination monitoring.
测试晶圆片-影印过程中用于颗粒计算、测量溶解度和检测金属污染的晶圆片。
7.
Premium Wafer- A wafer that can be used for particle counting, measuring pattern resolution in the photolithography process, and metal contamination monitoring.
测试晶圆片-影印过程中用于颗粒计算、量溶解度和检测金属污染的晶圆片。
8.
Profilometer - A tool that is used for measuring surface topography.
表面形貌剂-一种用来测量晶圆片表面形貌的工具。
9.
Ingot- A cylindrical solid made of polycrystalline or single crystal silicon from which wafers are cut.
晶锭-由多晶或单晶形成的圆柱体，晶圆片由此切割而成。
10.
Design of the transistor characteristic test system based on 51 MCU
基于51单片机的晶体管特性测试系统的设计
11.
Bonded Wafers- Two silicon wafers that have been bonded together by silicon dioxide, which acts as an insulating layer.
绑定晶圆片-两个晶圆片通过二氧化硅层结合到一起，作为绝缘层。
12.
Haze - A mass concentration of surface imperfections, often giving a hazy appearance to the wafer.
雾度-晶圆片表面大量的缺陷，常常表现为晶圆片表面呈雾状。
13.
Notch- An indent on the edge of a wafer used for orientation purposes.
凹槽-晶圆片边缘上用于晶向定位的小凹槽。
14.
Bonding Interface- The area where the bonding of two wafers occurs.
绑定面-两个晶圆片结合的接触区。
15.
Primary Orientation Flat- The longest flat found on the wafer.
主定位边-晶圆片上最长的定位边。
16.
Slip- A defect pattern of small ridges found on the surface of the wafer.
划伤-晶圆片表面上的小皱造成的缺陷。
17.
Mound- A raised defect on the surface of a wafer measuring more than0.25 mm.
堆垛-晶圆片表面超过0.25毫米的缺陷。
18.
Pit- A non-removable imperfection found on the surface of a wafer.
深坑-一种晶圆片表面无法消除的缺陷。