1.
Research on the Polishing of Silicon Wafer by Fixed Abrasive Pad
固结磨料抛光垫抛光硅片的探索研究
2.
Analysis on temperature field when polishing with ice fixed abrasives based on FEM
基于有限元法的硅片冰冻固结磨料抛光温度场分析
3.
Fixed abrasive lapping and polishing:present situation and prospect
固结磨料研磨与抛光的研究现状与展望
4.
Experimental study on polishing of mobile phone panel glass with unfixed-abrasive and fixed-abrasive pad
游离和固结金刚石磨料抛光手机面板玻璃的试验研究
5.
Removal function of computer controlled polishing SiC mirror with fixed abrasive
固着磨料抛光碳化硅反射镜的去除函数
6.
Improvement on Polishing Performance of Ce_(0.8)Zr_(0.2)O_2 Solid Solution Abrasives for ZF7 Optical Glass
Ce_(0.8)Zr_(0.2)O_2固溶体磨料对ZF7光学玻璃抛光性能的改善
7.
head ,grinding, sharpening, polishing, trueing and cutting, of natural stone, abrasives or pottery
研磨、磨、磨利、抛光、整形和切割头,天然石料,研磨料或陶质料制
8.
polished dressing
磨光，抛光，敷面打光，研磨
9.
Research of Polishing Technology for InSb Semiconductor Materials
InSb半导体材料抛光研磨技术研究
10.
disc ,grinding, sharpening, polishing, trueing and cutting of natural stone, abrasives or pottery
圆盘,研磨、磨利、抛光、整形和切割用,天然石料、研磨料或陶器制成
11.
Using refined grinding material to polish in order to get the mirror effect.
采用精细磨料抛光形成镜面效果的材料。
12.
Influence of abrasive and chemical composition on chemo-mechanical polishing of MgO single crystal substrate
抛光液中磨料和化学成分对单晶MgO基片化学机械抛光的影响
13.
The most common finishing operations are mechanical, such as milling, grinding, or polishing with abrasives.
最普通的精加工工序是用机械的方法，如研磨，磨削或用磨料抛光。
14.
Preparation and Size Classification of Alumina Series Abrasive Particles for Chemical Mechanical Polishing;
氧化铝系化学机械抛光磨料的制备及颗粒分级
15.
Research on Abrasive Water Jet Polishing Process for SLA Prototype;
用于SLA原型的磨料水射流抛光工艺研究
16.
Preparation of Ti or Zr-doped Ceria Abrasives and Their Chemical Mechanical Polishing Performance
钛锆掺杂CeO_2磨料的制备及其化学机械抛光性能
17.
Experimental Research on Optimizing Processing Parameters of Ultrasonic Polishing without Abrasive
无磨料超声抛光工艺参数优选试验研究
18.
COMPARATIVE ANALYSIS OF ABRASIVE FOR SHOT BLASTING STEEL STRUCTURE
钢结构抛丸(喷丸)清理用金属磨料的对比分析