1.
Warpage of Three-Dimensional Multi-Chip Module Based on Embedded Substrate
基于埋置式基板的三维多芯片组件的翘曲研究
2.
Study on Thermal Placement Optimization of Stacked 3D-MCM Based on Thermal Superposition Model
基于热叠加模型的叠层3D多芯片组件芯片热布局优化研究
3.
Analysis of the Interconnect in Microwave Multi-chip Module by Parallel FDTD Technique;
并行FDTD技术分析微波多芯片组件的互连效应
4.
Performance of a silicon-based embedded MMCM package
一种硅埋置型微波多芯片组件封装的电性能
5.
The Overlap-Combination Approach to Chip-Level 3-D Capacitance Extraction;
采用重叠组合方法进行芯片级三维电容提取的研究
6.
Study on the CYP2C9 and CYP2C19 genetic polymorphism in Chinese subjects by using 3-dimense polyacrylamide gel-based microarray platform
三维凝胶基因芯片法研究中国人群CYP2C9与CYP2C19基因多态性
7.
Characteristics simulation of MEMS packaging using multichip modules technology
基于微机械系统的多芯片组件封装和特性模拟(英文)
8.
Design and transmission characteristics simulation in MCM placement and routing
多芯片组件高速电路布局布线设计及信号传输特性仿真
9.
Finite Element Simulation of Reliability and Life Prediction on Solder Joint of MCM;
多芯片组件（MCM）焊点可靠性的有限元模拟与寿命的预测
10.
Multi-chip Array Combination White Light LED Seal Research
多芯片阵列组合白光LED封装研究
11.
Development of Recognized Software on Multi-tumor Protein Chip Analysis System V1.0
多肿瘤蛋白芯片肿瘤判别软件的研制
12.
The research of multidimensional separation mode applied in micro fluidic chip and its application in life science is summarized.
综述了多维分离模式在微流控芯片中的应用以及多维芯片在生命科学中的应用。
13.
Design and Implementation of FPGA Hardware Emulation Platform and MIPS Chipset;
FPGA硬件仿真平台和MIPS芯片组的设计与实现
14.
Design of Tri-phase Multi-rate Watt Hour Meter Based on Energy Metering IC;
基于专用芯片的三相多费率电能表研制
15.
Development of a Miniature T/R Front-end Using Microwave Multi-Chip Module Technology
基于多芯片组装技术的小型微波收发前端研制
16.
3-D numerical simulation of welding spherical valve core
球形阀芯缩口工件的焊接三维数值模拟
17.
Construct cell immuno-chip with tissue microarray technique
应用组织芯片技术构建细胞免疫芯片
18.
Chipsets are key components in computers and other electronic devices that act as nervous systems channelling data between CPUs and other chips.
芯片组是电脑和其它电子装置的关键部件，是CPU和其它芯片之间数据传输的中枢系统。