1.
Thermal-resistance Calculation of the Forced Air Cooling Heatsink Applying for Power Semiconductor Devices
大功率半导体器件用散热器风冷热阻计算
2.
FEA Method of High-power Semiconductor Encapsulation
大功率半导体器件封装结构的有限元分析
3.
Theory of Semiconductor Power Devices ?
半导体功率器件理论
4.
Advantage and Development Foreground of SiC Pwer Sewmiconductor Devices
SiC功率半导体器件的优势及发展前景
5.
Study on Power Conversion Efficiency of High-power Laser Diodes
大功率半导体激光器功率转换效率的研究
6.
Research and Design on the Control System for High Power Diode Laser;
大功率半导体激光器控制系统的研制
7.
Study on 1450nm High Power Semiconductor Laser Array;
1450nm大功率半导体激光器阵列研究
8.
Research on Fiber Coupling for High-Power Laser Diode Array;
大功率半导体激光器的光纤耦合研究
9.
The Study on Antireflection Films of 808nm Semiconductor Laser and SLA;
808nm半导体功率放大激光器增透膜研究
10.
High power high duty-cycle 808 nm wavelength laser diode
808nm高占空比大功率半导体激光器阵列
11.
Study of Micro-Channel Cooling High Power Semiconductor Laser
微通道散热大功率半导体激光器研究
12.
1.06 μm High Power CW Semiconductor Lasers
1.06μm大功率连续半导体激光器
13.
Study on the Coupling of Laser with Semiconductor Power Amplification
半导体功率放大激光器耦合效率的研究
14.
Study on LD Pumped High Power Green Pulse Laser;
半导体激光器泵浦的大功率脉冲绿光激光器
15.
Breakdown Phenomena of Semiconductor Devices under the Impact of Hemp;
高功率电磁脉冲辐射下半导体器件的击穿效应
16.
Power Semiconductor Devise and Packaging Advances Target Automotive Applications
面向汽车应用的功率半导体器件与封装
17.
New Development of Junction Termination Techniques for Power Devices
硅材料功率半导体器件结终端技术的新发展
18.
Recent Development and Future Perspective of Silicon Carbide Power Devices--Opportunity and Challenge
宽禁带半导体SiC功率器件发展现状及展望