1.
Study on the thixoforming of electronic packaging shell with SiC_P and Al alloy
碳化硅铝合金材料触变成形电子封装壳体研究
2.
Fabrication and Properties of SiCp/Al Electronic Packaging Housing by Gas Pressure Infiltration;
气压浸渗SiCp/Al电子封装外壳的制备与性能
3.
Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
GB/T14862-1993半导体集成电路封装结到外壳热阻测试方法
4.
electronic proBes into the crust of the earth.
勘察地壳的电子装置
5.
electron gun vacuum lock
电子枪真空密封装置
6.
Seal and fix PES membrane in the Polycarbonate (PC) shell to form a hollow fiber membrane hemofilter.
将pes膜封装固定在聚碳酸酯壳体内 ,组装成中空纤维膜血液滤过器。
7.
The finished rotor and stator unit is then assembled into a central motor housing unit.
转子和定子成品然后装配进中央电机壳装置内。
8.
Abstract: A high density packaging with superior thermal con duction and electrical performance, in which metal served as substrate or package, is introduced in this paper.
文摘:以金属为外壳的封装是一种新的高密度封装技术，具有优异的导热性能及电性能。
9.
The FEA Simulation of Moisture Diffusion in Electronic Packages;
塑料电子封装件中湿扩散有限元分析
10.
Study on Electroless Ni-P Film Plating in Microelectronic Packaging
微电子封装中化学镀Ni-P薄膜研究
11.
Electron-induced Damage of CMOS with Shielded Packages
屏蔽材料封装CMOS器件的电子辐照损伤
12.
Fundamental Study of Novel Si-Al Electronic Packaging Materials
新型电子封装Si-Al合金的基础研究
13.
The Application of "5S" Activity in Electronic Packaging Industry
“5S”管理在电子封装企业中的应用
14.
To provide a housing or case for(a machine part, for example).
装箱为（机体，例如）提供套壳或箱子
15.
(of an electronic device) equipped with transistors.
（指电子装置）装有晶体管。
16.
Terminology of packages for semiconductor integrated circuits
GB/T14113-1993半导体集成电路封装术语
17.
Research on EMI Shielding Inside Hybrid Intergrated Power Electronic Module
混合封装电力电子集成模块内电磁干扰的屏蔽
18.
Application of Low Melting Point Alloys to Processing of TC4 Case Packaging
低熔点合金灌注在钛合金封装壳体加工中的应用