1.
Study on the thixoforming of electronic packaging shell with SiC_P and Al alloy
碳化硅铝合金材料触变成形电子封装壳体研究
2.
Application of Low Melting Point Alloys to Processing of TC4 Case Packaging
低熔点合金灌注在钛合金封装壳体加工中的应用
3.
Seal and fix PES membrane in the Polycarbonate (PC) shell to form a hollow fiber membrane hemofilter.
将pes膜封装固定在聚碳酸酯壳体内 ,组装成中空纤维膜血液滤过器。
4.
Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
GB/T14862-1993半导体集成电路封装结到外壳热阻测试方法
5.
solid front case with pressure relief at back
后部带泄压装置的前封式外壳
6.
Kiln head seal person who adopts clamshell seal, kiln tail equips with the contact-type sealinstallation of the axial, have guaranteed sealed dependability.
窑头密封采用了壳罩式密封，窑尾装有轴向接触式密封装置，保证了密封的可靠性。
7.
hydraulic oil pump driving device housing
液压油泵传动装置壳体
8.
flanged-mounted injection nozzle holder
突缘安装喷油器壳体
9.
The analyser is housed in an explosion-proof enclosure.
分析器装在防爆壳体里。
10.
epoxy seal transistor
环氧树脂封装晶体管
11.
Only the new device is housed in sealed water proof case.
只有这种新装置才具有密封防水的外壳。
12.
Fabrication and Properties of SiCp/Al Electronic Packaging Housing by Gas Pressure Infiltration;
气压浸渗SiCp/Al电子封装外壳的制备与性能
13.
Analysis of Welding Casing of Active Implantable Medical Devices
有源植入式医疗器械外壳封装工艺分析
14.
Verify that housing alignment dowels are in position before installing housing.
安装壳体前先验证壳体校准销均已定位。
15.
There are four translators in each package so a number of lines may be interfaced.
在每个封装壳中装有4个变换器，从而可以同许多线接口。
16.
Abstract: A high density packaging with superior thermal con duction and electrical performance, in which metal served as substrate or package, is introduced in this paper.
文摘:以金属为外壳的封装是一种新的高密度封装技术，具有优异的导热性能及电性能。
17.
At the earlier stage of eutectic, the enveloped or nor- enveloped frame austenite shell lias formed.
共晶前期石墨球局围形成封闭或不封闭的框架奥氏体壳;
18.
invertebrate having a soft unsegmented body usually enclosed in a shell.
无脊椎动物，身体软而不分节并经常封在壳中。