1.
Research on Design Method and Properties of Eletronic Packaging Single Crystal Copper Wire;
电子封装单晶铜键合丝制备工艺及性能研究
2.
Evaluation of Bondability and Reliability of Single Crystal Copper Wire Bonding in Semiconductor Packaging;
单晶铜丝在半导体器件封装中的打线键合性能研究
3.
Effects of Annealing and Drawing on Properties of Single Crystal Copper Bonding Wire
冷变形和热处理对单晶Cu键合丝性能影响
4.
Study on the Preparation and Ball Bonding Process for the High-Performance Copper Bonding Wire
高性能键合铜丝的制备及其球键合工艺研究
5.
a copper pipe, wire, alloy, etc
铜管、 丝、 合金等
6.
Intermetallic Compounds Formation and Reliability on Bonding Joints of Copper Wire and Gold Wire with Aluminum Alloy Pad;
铜及金丝与铝合金焊盘键合的金属间化合物生长和可靠性
7.
Radial Nanofretting of Copper Silicon and Niti Shape Memory Alloys;
铜、单晶硅与镍钛形状记忆合金的径向纳动研究
8.
Nano-crystalline beryllium-Coppery alloy prepared by melt-spin method and its structural analysis
单辊旋淬法制纳米晶铜铍合金及结构分析
9.
Synthesis and Crystal Structure of a Novel 2D Network Copper Complex Constructed Through Hydrogen Bonds Linking Zigzag Chains
氢键联结锯齿链形成的新型二维网状铜配合物的合成及晶体结构
10.
SYNTHESIS AND CRYSTAL STRUCTURES OFMONONUCLEAR,CONJUGATED MONONUCLEAR ANDBINUCLEAR COPPER(Ⅱ)-SCHIFF BASE COMPLEXES;
单核、共轭单核、双核Schiff碱铜配合物的合成及晶体结构(英文)
11.
STUDY ON PRODUCING PURE COPPER SINGLE CRYSTAL INGOT BY CONTINUOUS CASTING OF SINGLE CRYSTAL METALS(CCSC);
单晶连铸法制备铜单晶体的试验研究
12.
Copper winding wires with silk covering--Single wire with silk covering
GB/T11018.2-1989丝包铜绕组线丝包单线
13.
Fabrication and Thermal Evolution of Nanoparticles in Al_2O_3 Crystals by Cu Ion Implantion
铜离子注入氧化铝单晶纳米颗粒合成及热演变研究
14.
Crystallization and Mechanical Property of Cu-Zr-Based Bulk Metallic Glass;
铜锆基大块非晶合金晶化及力学性能
15.
APPLICATION OF CRYSTAL PLASTICITY THEORY FOR MODELLING LOW CYCLIC FATIGUE OF SINGLE CRYSTAL COPPER
晶体塑性模型在单晶铜低周疲劳行为中的应用
16.
monofil of synthetic fibres materials
合成纤维材料单丝合成纤维单丝
17.
The Microstructure and Mechanical Property of Lead-free Solder/copper Single Crystal Interface;
铜单晶体/无铅焊料的界面组织与性能
18.
Study on Copper Single Crystal Grown by Vertical Bridgman Method
垂直布里奇曼法生长铜单晶体的研究