1.
Wan De sheng Electronics Equipment Co., Ltd. is the invigation of your future lead-free craft.
万德盛电子设备有限公司是您未来无铅工艺的领航者！
2.
Lead-Free Process Compatible No-Flow Prepreg for Rigid-Flex PCB
应用于刚挠印制板无铅工艺兼容的不流动性半固化片
3.
Investigation on Fabrication of a Low Melting Point Lead-free Sn-Bi-X Solders and Lead-free Soldering Process;
低熔点无铅焊料Sn-Bi-X的研制与无铅焊接工艺研究
4.
Research on the New Lead-Free Solder Processing Properties of Brazing and Mechanical Properties;
新型无铅钎料钎焊工艺性及机械性能的研究
5.
Studies on the Doping and Preparation of BNT-Based Lead-Free Piezoelectric Ceramics
BNT基无铅压电陶瓷的掺杂改性及制备工艺研究
6.
Research on Alkali-free Flotation Process of Soluble Salt-rich High Sulfur Lead-zinc Ores
富含可溶性盐高硫铅锌矿无碱浮选工艺研究
7.
A Study of the Plating Process for Preparing Sn-Cu Lead-Free Solders by Electrodeposition
电沉积制备Sn-Cu无铅钎料电镀工艺的研究
8.
Non-cyanogen Craft Research on Some Sulfide Minerals Ore Associated with Lead and Zinc
某伴生铅锌硫化矿的无氰工艺试验研究
9.
Chinese art metal
中国工艺品用铅锡黄铜
10.
The exploratory experiment of cyanide-free separating technology of lead-zinc in the slime for a concentration plant had been carried out.
对某选矿厂矿泥的无氰铅锌分离工艺进行了探索研究。
11.
More than3 years working experiences in SMT processing and strong willing to be a technical sales in selling lead-free solder paste.
暌陨蟂MT生产线工艺制程控制经验，具有销售无铅锡膏产品的愿望。
12.
The Research on Processing and Properties in Textured K_(0.5)Na_(0.5)NbO_3 Lead-free Piezo-electric Ceramics;
织构型K_（0.5）Na_（0.5）NbO_3无铅压电陶瓷制备工艺及性能研究
13.
The Effect of Processing Property and Interface Behavior in the Joints of the Sn-based Lead Free Solder with Additional Elements;
添加元素对Sn基无铅钎料工艺性能及接头区界面行为的影响
14.
Production Characteristic of the Solder Dross during Lead-Free Wave Soldering and Process Solution of Reducing It;
无铅波峰焊钎料氧化渣形成特点及其改善的工艺措施
15.
The influence of different powder-preparing techniques on properties of potassium-sodium niobium lead-free piezoelectric ceramics
不同粉体制备工艺对铌酸钠钾无铅压电陶瓷性能的影响
16.
Separation of Antimony from Lead for Pd-Sb Complex Sulfide Ores by Steam;
铅锑复杂硫化矿铅锑分离的理论及新工艺研究
17.
A Study on New Leaching Process of Galena or Jamesonite Concentrate;
方铅矿及脆硫铅锑矿的浸出新工艺研究
18.
It covers the background, solders, surface finishes, components, substrates, assembly processes, rework, and reliability of lead-free soldering.
包括背景，焊料，表面镀层，元器件，基板，组装工艺，返工和无铅焊接的可靠性。