1.
FINITE ELEMENT IMPLEMENTATION TO TIME-DEPENDENT CONSTITUTIVE MODEL OF SOLDER IN MICRO-ELECTRONIC PACKAGING
微电子封装钎料时相关本构模型的有限元实现
2.
Time-Dependent Damage Coupled Constitutive Model of Solder Alloy in Micro-Electronic Packaging at High Tempertaure and It's Application;
微电子封装钎料高温时相关耦合损伤本构模型及其工程应用
3.
Constitutive Description of Temperature and Strain Rate Dependent Tensile Behaviors of Solder;
焊锡钎料温度与应变率相关拉伸性能的本构描述
4.
Research on the Liquid Structure of Lead-free Solders and the Interfacial Reaction during Soldering and Their Correlation;
无铅钎料的液态结构与钎焊界面反应及其相关性研究
5.
Damage-coupled Multiaxial Time-dependent Low Cycle Fatigue Failure for Electronic Packaging Solder Alloy
电子封装钎料合金耦合损伤的多轴时相关低周疲劳失效研究
6.
Constitutive Description of Tin-Lead Solder 63Sn-37Pb under Multiaxial Loading;
多轴加载下焊锡钎料63Sn-37Pb的本构描述
7.
Research on Time-Dependent Ratcheting Behaviors of Matel Materials and Its Constitutive Models;
金属材料的时相关棘轮行为及其本构模型研究
8.
Phase Constitution of Soldering Seam and Mechanical Properties of Zn Matrix Filler Metal Soldering Magnesium Alloy AZ31B Joint
Zn基钎料钎焊镁合金AZ31B接头的钎缝物相及力学性能
9.
Microstructure and shear strength of solder joints of SiC_p/Al composites with Ni plating with Sn-2.5Ag-2.0Ni solder
SnAgNi钎料钎焊Ni镀层SiC_p/Al复合材料的接头微观结构及剪切性能
10.
Strain Rate Related Constitutive Models for Polymer and Cement Mortar Materials;
高聚物与水泥砂浆材料率相关本构模型研究
11.
Microstructure and properties of Si_3N_4 ceramic joint brazed with rapidly-cooled Ag-Cu-Ti filler metals
Ag-Cu-Ti急冷钎料钎焊Si_3N_4陶瓷接头界面结构及性能
12.
Delaminating Behavior and Formation Mechanism of the Interfacial Microstructure in the Laser Brazing Diamond with Ni-Cr Alloys
Ni基钎料激光钎焊金刚石磨粒界面显微结构及形成机理
13.
An Instantaneous Elastic Constitutive Relation for Nonlinear Viscoelastic Materials;
非线性粘弹性材料的一个瞬时弹性本构关系
14.
Effect of Alloying Elements and Aging on Microstructure and Solder Interface of Sn-Zn Lead-free Solders
合金元素及时效处理对Sn-Zn无铅钎料组织和钎焊界面的影响
15.
This paper introduces the connection using the brazing technique, selects corresponding brazing filler metal and flux together with proper technology, and determines the techniques and measures.
介绍了采用钎焊的方法进行连接;选择了相应的钎料与钎剂;并确定了工艺及措施。
16.
Effect of Trace Ag on Properties and Interface Structure of Sn-0.7 Cu Solder
微量银对Sn-0.7Cu钎料性能及界面结构的影响
17.
Research of New Sn-Ag Based Lead-free Composite Solders Containing Nano-structured Reinforcements
纳米结构强化的新型Sn-Ag基无铅复合钎料
18.
Microstructures of Si/SiC Ceramic and Invar Alloy Brazing Joint
Si/SiC复相陶瓷与殷钢钎焊接头组织结构研究