1.
Influence of Fluorescent Glue Packaging Technology on the Color Rendering Index of High Power LED
大功率LED荧光胶封装工艺对其显色性能的影响
2.
Research & Fabrication of Packaging Technology for High-Power White LED
大功率白光LED封装工艺技术与研制
3.
air light fluorescent machine tool lamp
全封闭荧光机床工作灯
4.
Research of Demodulation and Packaging Tecknics on Fiber Grating Sensors;
光纤光栅传感器解调技术及封装工艺的研究
5.
Study on FBG Sensor′s Steel Capillary Packaging Technique and Sensing Properties
光纤光栅毛细钢管封装工艺及其传感特性研究
6.
PACKAGING OF WAVEGUIDE DEVICES BASED ON BULK SILICON MEMS TECHNOLOGY
基于体硅微机械工艺的光波导器件封装技术
7.
Improvement on the Packaging Process of 1X2 Single Mode FBT Fiber Splitters
1X2单模融拉型光纤分路器封装工艺的改进
8.
The Influence of the Different Mixture Ratio of Silica Gel and Phosphor on White LED's Performance
不同胶粉比封装对白光LED的影响
9.
Process Mechanics Modeling of Pressure Sensor Packaging and High-Brightness LED Packaging;
微压力传感器和白光LED封装的工艺力学数值模拟
10.
Electrophoresis and fluorospectrophotometry methods to determine the content and entrapment efficiency of siRNA in cationic liposomes
凝胶电泳法及荧光光度法测定siRNA阳离子脂质体的含量和包封率
11.
Study on property modification with nanometric particles for epoxy adhesive agent used to coat the fiber Bragg gratings
用于光纤光栅封装的环氧胶粘剂纳米改性研究
12.
Research on Devices and Experiments for Nano-Particle Colloid Jet Machining
纳米胶体射流抛光试验装置研制及工艺试验研究
13.
Brief Discussion on the Technique of T5 F28W Straight Tube Fluorescent Lamp
T5 F28W直管荧光灯制灯工艺浅谈
14.
Research of SU-8 Resist Lithography Using Ultraviolet Laser;
紫外激光曝光光刻SU-8胶的工艺研究
15.
The Performances Optimum of Organic Flourescent & Phosphorescent Devices and Study on the Encapsulation of OLEDs
有机电致荧光、磷光器件的性能优化与OLED封装技术的研究
16.
Study on Broad Band MMIC Package Design and Related Processes;
宽带MMIC的封装设计及相关工艺研究
17.
Technology of 3D Packaging and TSV
3D封装与硅通孔(TSV)工艺技术
18.
Application of Plasma Cleaning in LED Package Process
等离子清洗在LED封装工艺中的应用