1.
Flowability Analysis of the Epoxy Molding Composite used for the Packaging of Large-Scale Integrated Circuit
大规模集成电路封装用环氧树脂复合材料流动性影响分析
2.
Synthesis of Hexaphenylamine Cyclotriphosphazene Flame Retardant and Its Application in Epoxy Molding Compound for Large-scale Integrated Circuit Packaging
六苯胺环三磷腈的制备及其对大规模集成电路封装用环氧模塑料的无卤阻燃
3.
large scale compound integration
大规模组合集成电路
4.
large-scale integrated memory
大规模集成电路存储器
5.
large scale integrated chip
大规模集成电路芯片
6.
large scale hybrid integrated circuit
大规模混合集成电路
7.
matrix large scale integration
矩阵型大规模集成电路
8.
The Company's primary business is IC component packaging and test and memory module assembly.
公司的主要业务是集成电路封装测试和内存模块装配。
9.
silicon on sapphire large scale integration
蓝宝石上硅大规模集成电路
10.
VLSI Circuits and Systems ?
超大规模集成电路与系统
11.
large scale integrated circuit testing techniques
大规模集成电路测试技术
12.
Building SLSI Design Platform
超大规模集成电路设计平台建设初探
13.
Research on Routing Algorithms for VLSI Circuits;
超大规模集成电路若干布线算法研究
14.
Research on Parallel Seam Sealing Process for LSI;
大规模集成电路的平行缝焊工艺研究
15.
A Investigation of on Chip Parasitic Parameter Extration;
超大规模集成电路寄生参数提取研究
16.
The Design and Development of The Large Scale IC C9901;
大规模集成电路C9901的设计开发
17.
Semiconductor integrated circuits--Specification for stamped lead frames of plastic DIP
GB/T14112-1993半导体集成电路塑料双列封装冲制型引线框架规范
18.
Cost Management Mode and Its Application in IC Assembly and Test Enterprises;
集成电路封装测试企业成本管理模式及应用研究