1.
Study on the "Haze" Problem of Stored Silicon Wafer
Si抛光片存储中表面起“雾”的研究
2.
Effect of Polishing Processes on the Roughness of GaAs Wafers
抛光工艺对GaAs抛光片粗糙度的影响
3.
Research on the Polishing of Silicon Wafer by Fixed Abrasive Pad
固结磨料抛光垫抛光硅片的探索研究
4.
Chemical mechanical polishing for silicon wafer by composite abrasive slurry
利用复合磨粒抛光液的硅片化学机械抛光
5.
Study of Luminous Efficiency of Blue GaN-LED Chip on Si Substrate;
Si衬底GaN基蓝光LED芯片出光效率的研究
6.
Swirl marks are removed by polishing. Covering one small section at a time allows you to check your progress.
抛光可以祛除涡痕。小片小片的抛光及时检查你的工作。
7.
Epitaxial Growth of Bi_2Sr_2CaCu_2O_x/YSZ Films on Si Wafer by Pulse Laser Deposition;
Si基片上脉冲激光外延生长Bi_2Sr_2CaCu_2O_x/YSZ复合薄膜
8.
The Czochralski silicon monocrystalline polished wafer with a diameter of eight inches
8英寸直拉硅单晶抛光片
9.
Test methods for surface flatness of silicon polished slices
GB/T6621-1995硅抛光片表面平整度测试方法
10.
Polished monocrystalline sapphire substrates
GB/T13843-1992蓝宝石单晶抛光衬底片
11.
Study on High Quality Surface Protection of Single Crystal MgO Polishing Substrate;
单晶MgO抛光基片高质量表面保护研究
12.
An Experimental Study of the Polishing Process for MgO Single Crystal Substrate;
单晶MgO基片抛光工艺的实验研究
13.
An Experimental Study of the Polishing Process for CZT Crystal;
碲锌镉晶体基片抛光工艺的实验研究
14.
Research of Polished Technology of VB GaAs Wafers
VB-GaAs单晶片抛光技术研究
15.
Study on the Surface-State of GaAs Polished Wafer for the Use of LED
LED用砷化镓抛光片表面状态研究
16.
Material removal characteristic of silicon wafers in chemical mechanical polishing
单晶硅片化学机械抛光材料去除特性
17.
Research on Cleaning Process of GaAs Polished Wafer for LED
LED用GaAs抛光片清洗技术研究
18.
Study on Surface Chemical Polishing of HgInTe Wafers
HgInTe晶片表面化学抛光研究