1.
Simultaneous Dissolution of Tin and Slive in Copper Solder and Determination by ICP-AES
同时溶解和ICP-AES同时测定铜基锡银焊料中的锡和银
2.
The Research on Brazing Process betweeen W-Cu Heat Sink with Plated Nickel and Silver-copper Solder
镀镍钨铜与银铜焊料钎焊工艺的研究
3.
spelter brazing alloy
铜锌基硬钎焊料合金
4.
"But gold and silver and brass and iron and tin and lead,"
金，银，铜，铁，锡，铅，
5.
tin-lead 60-40 solder
锡铅60-40焊料
6.
Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。
7.
Effect of Cerium on Property and Microstructure for SnAgCu Lead Free Solder;
稀土铈对锡银铜无铅钎料组织性能的影响
8.
Electroplating Process and Mechanism of Tin-Silver-Copper Alloy and Solder Properties of Deposits
锡银铜合金的电沉积工艺与沉积机制及其焊接性能的研究
9.
Effect of microamount Ce on the interfacial IMC between SnAgCu solder and Cu substrate
微量Ce对SnAgCu焊料与铜基界面IMC的影响
10.
Sn-Pb soldering used in Ground-based Aeronautical Communication Equipment Manufacturing.
用于地基航空通讯设备制造业的铅锡焊料。
11.
Research Progress and Development Tendency of Tin-based Lead-free Electronic Solder
锡基无铅电子焊料的研究进展与发展趋势
12.
Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。
13.
Casting tin-lead solders
GB/T8012-1987铸造锡铅焊料
14.
Sterling aluminium solder
斯特林锡锌铝合金焊料
15.
Tin-lead solders-Determination of silver content -Potentiometric titrimetric method
GB/T10574.9-1989锡铅焊料化学分析方法电位滴定法测定银量
16.
Tin-lead solders-Determination of silver content-Flame atomic absorption spectrophotometric method
GB/T10574.8-1989锡铅焊料化学分析方法火焰原子吸收光谱法测定银量
17.
Synthesis and Electrochemical Performance of Multi-element Tin and Copper Based Alloy Negative Materials;
锡铜基多元合金负极材料的制备及电化学性能
18.
solder that contains copper; melts at a relatively high temperature; used for brazing.
含铜的焊料，熔点较高，用于铜焊。