1.
Effects of Voids on Thermal Reliability in Power Chip Die Attachment Solder Layer
空洞对功率芯片粘贴焊层热可靠性影响的分析
2.
Effect of different adhesives on the evolution of residual stress at chip surface during and after curing for COB packages
粘接剂对直接粘贴芯片表面残余应力的影响
3.
Two basic forms of the resistance strain gage are the bounded and the unbounded types.
电阻应变片有粘贴式和非粘贴式两种基本形式。
4.
Failure Mode of Die Bonding and Improved Path of Bonding Strength
芯片粘接失效模式及粘接强度提高途径
5.
Multidomain Unified Modeling and Simulation of Die Bonder;
芯片粘片机多领域统一建模与仿真分析
6.
Moving Stiffness Analysis on the Parallel Bonding Mechanism of IC Chip Die;
IC芯片粘片机并联焊头机构的动刚度分析
7.
Study on Inspection of SMT Chip Pins Based on Machine Vision;
基于机器视觉的表面贴装芯片引脚检测的研究
8.
Application of Mucins Protein Chip in Diagnosis of Pancreatic Cancer;
粘蛋白芯片在诊断胰腺癌中的临床应用研究
9.
Experimental Study on Adhesive Ability of PDMS Chips and Microextraction System;
PDMS芯片粘接性能及微萃取系统的实验研究
10.
Mechanical Behavior Analysis on Reinforced Concrete Beams Strengthened with FRP Laminates;
粘贴纤维片材的钢筋混凝土梁力学行为分析
11.
Preparation and Application on Heat-Resisting Inorganic Adhesive Used for CFRP Laminate-Strengthening;
粘贴CFRP片材用耐高温无机胶的制备及应用研究
12.
Sticking Technology of Resistance Strain Gauge in Determining Test of Residual Stress by the Blind-hole Technique
盲孔法残余应力测试中的电阻应变片粘贴技术
13.
Analysis of Kinematics and Dynamics and Experimental Research for Parallel Bonder of IC Die Bonder;
IC芯片粘片机并联焊头机构的运动学动力学分析及实验研究
14.
To cause to adhere by or as if by applying paste.
粘贴，张贴用或好象用浆糊使…粘贴起来
15.
super chip
高密度芯片,超级芯片
16.
The board and chip are then heated to melt the solder and join the two together.
然后加热面板和芯片的缝合处，使焊锡熔化，从而把二者粘在一起。
17.
A temporary stream store used to store text/ pictures. Used in copying, cutting and pasting text.
一个临时的流存贮（间）来存放文本/片。在拷贝，剪切和粘贴文本时使用。
18.
Hang a poster, give a slide show, send an e-mail greeting, or put up a screen-saver for all to see.
可以选择粘贴海报，放映幻灯片，发电子贺卡或设制屏幕保护。