1.
Study on the microstructure of transint liquid phase diffusion bonding joint of 16Mn steel
16Mn钢的瞬间液相扩散焊接头微观组织
2.
Interface behavior of TLP between chromium-copper alloy and stainless steel
铬青铜与不锈钢瞬间液相扩散焊接界面行为
3.
Contrast analysis of 10Cr9Mo1VNb steel pipe transient liquid-phase bonding and TIG+SMAW
10Cr9Mo1VNb钢管的瞬时液相扩散连接与TIG+SMAW焊对比分析
4.
Research of Transient Liquid Phase Joining Machine for Oil-pipeline Welding;
管道的瞬时液相扩散焊（TLP）焊机研究
5.
Applications of transient liquid-phase bonding in nickel and nickel-base alloy welding
瞬时液相扩散连接在镍及镍基合金焊接中的应用
6.
Effect of Holding Time on TLP Bonding of 20 Steel Pipes
保温时间对20钢管道瞬时液相扩散连接的影响
7.
Effects of Intelayer Composition on Transient Liquid Phase Bonding Process
中间层成分对瞬时液相扩散连接过程的影响
8.
Investigation of Transient Liquid Phase Bonding for 12Cr1MoV/TP304H Heterogeneity Steel Pipes;
12Cr1MoV/TP304H异种管材的瞬时液相扩散连接
9.
Microstructure and mechanical property of transient liquid phase bonded aluminum silicon alloy joint
Al-Si合金瞬间液相扩散连接接头组织与力学性能
10.
Transient Liquid-phase Bonding with Two-step Heating Process of TP304H/12Cr2MoWVTiB Dissimilar Steel Pipe
TP304H/12Cr2MoWVTiB异种钢管的双温瞬时液相扩散焊工艺
11.
Transient Liquid Diffusion Bonding Process of Pearlite Heat-resistant Steel 12Cr1MoV
珠光体耐热钢12Cr1MoV的瞬时液相扩散连接工艺
12.
Reserch on Nonplanar Interfaces Formed by Transient Liquid Phase Diffusion Bonding Process
瞬时液相扩散连接非平面结合界面的研究现状
13.
Influence of Bonding Temperature on Microstructure and Property of T91/102 TLP Joint
连接温度对T91/102异种钢管瞬时液相扩散连接接头组织性能的影响
14.
Joint Interface and Strengthen of Transient Liquid Phase Bonding for Heat-Resistance Steel;
耐热钢瞬时液相扩散连接界面结构与强化机制研究
15.
The Key Parameters of the Transient Liquid Phase Diffusion Bonding Process and Selection Principle
瞬时液相扩散连接过程中的关键参数及其选用原则
16.
An Investigation of Phase Transformation Superplastic Diffusion Bonding of Titanium Alloy/Pure Nickel/Stainless Steel;
钛合金/纯镍中间层/不锈钢的相变超塑性扩散焊接研究
17.
Novel Process of Active-Transient Liquid Phase(A-TLP) Bonding for Aluminum Matrix Composite
铝基复合材料的活性液相扩散焊新工艺
18.
The Research on Microstructural Evolution and Diffusing Behaviour during TLP Bonding Using Nickel-base Interlayer
镍基中间层TLP焊接的组织转变与扩散行为研究