1.
Study on Simulation and Experiment of Ground Wafer Shape in Rotational Grinding Method;
硅片自旋转磨削面型仿真与实验研究
2.
Analysis and simulation of grinding motion on large size wafer self-rotating grinding
大尺寸硅片自旋转磨削运动分析及仿真
3.
Research the Key Technology of Silicon Wafer's Grinding Device Based on Silicon Wafer Rotating;
硅片自旋磨削试验台关键技术的研究
4.
This machine is ideal for grinding various types of turning tool.
磨削时砂轮能旋转自如用于正反向车刀的逆转磨削。
5.
Development of Soft Abrasive Wheel Used in Ultra-precision Grinding Silicon Wafer
超精密磨削硅片的软磨料砂轮的研制
6.
Study on Removal Mechanism of Ductile-Mode Grinding in 300mm Silicon Wafer Surface Grinding Process
300mm硅片表面延性磨削机理研究
7.
rotary slicer with sharpener
旋转切片器附磨刀器
8.
Study on Grinding-based Flattening Theory and Process Technology for Large-sized Silicon Wafer;
大尺寸硅片磨削平整化理论与工艺技术的研究
9.
Study on the Surface Layer Damage of Monocrystalline Silicon Wafer Induced by Ultra-precision Grinding;
单晶硅片超精密磨削加工表面层损伤的研究
10.
Study on Surface/subsurface Damage Detection of Ultraprecision Ground Silicon Wafer;
超精密磨削硅片表层损伤检测的试验研究
11.
Study on Surface Quality and Material Removal Rate of Wafer Ultra-precision Grinding;
硅片超精密磨削表面质量和材料去除率的研究
12.
Experimental Research on Ultra-precision Grinding Technology for Silicon Wafer Thinning
单晶硅片超精密磨削减薄技术试验研究
13.
"To grind a cylindrical form, the workpiece rotates as it is fed against the grinding wheel."
磨削工件的外圆时,工件旋转并向砂轮进给。
14.
A New Type of Rotary Ultrasonic Composite Grinding Head and Serialization;
新型旋转超声复合磨削头及其系列化研究
15.
Study on Auto-programming Technique in CNC Form Grinding of Spiral Surface;
螺旋曲面数控成形磨削自动编程技术的研究
16.
a revolving stone disk; used to grind or sharpen or polish edge tools.
一种旋转的石头的圆盘；用于研磨或削尖或打光工具边缘。
17.
Grinding Performance of Soft Abrasive Grinding Wheel Used in Ultra-precision Grinding Sapphire Substrate;
超精密磨削蓝宝石基片的软磨料砂轮磨削性能
18.
rotary abrasive tester
旋转式磨料磨损试验机