1.
Design of GFP Encapsulation and De-encapsulation Module in EoS
EoS中GFP封装与解封装模块的设计
2.
The Design and Realization of Encapsulation and Access Modeling on Modules
模块的封装与调用模型的设计与实现
3.
The Research of Small Form Factor Pluggable Transceiver with Digital Diagnose Monitor Function;
带数字诊断功能的小封装光模块研究
4.
Sintering Technology of Power Modules:A Packaging with Good Design
功率模块的烧结技术——良好设计的封装
5.
The Packaging Structure and Development Trend of Intelligent/smart Power Module
智能功率模块的封装结构和发展趋势
6.
Mask Subsystem Design of Boiler Model under Matlab/Simulink
Matlab/Simulink环境下锅炉模块封装子系统设计
7.
Power Electronics Modules Packaging and Integrative Packaging--Focusing on the Renewable Energy and Electric Vehicles
功率模块的封装和“一体化”封装——一针对可再生能源和电动交通工具
8.
Research on EMI Shielding Inside Hybrid Intergrated Power Electronic Module
混合封装电力电子集成模块内电磁干扰的屏蔽
9.
Study on the Dissipation and Packaging of High Power Laser Diode Module;
大功率半导体激光模块的散热与封装研究
10.
Research on Integration of the Vision and Motion Parts in Pre-Bonding Module of RFID Packaging Machine;
RFID封装线预绑定模块的视觉与运动集成研究
11.
The Company's primary business is IC component packaging and test and memory module assembly.
公司的主要业务是集成电路封装测试和内存模块装配。
12.
On the modular design of the form - fill - seal packaging machine based on reverse engineering;
基于反求工程的制袋—充填—封口包装机模块化设计
13.
Integrated power electronics module based on chip scale packaged power devices
基于芯片尺寸封装功率器件的集成电力电子模块(英文)
14.
Encapsulation of Refrigeration Compressor Performance Test Data Acquisition Module Base on ActiveX Technique
基于ActiveX技术的压缩机性能测试数据采集模块的封装
15.
Optimised Integration of PrimePACK~(TM) into Modular IGBT Stacks with Increased Power Density
PrimePACK~(TM)封装优化集成模块内的IGBT叠层可提高功率密度
16.
&Module Load Breakpoint...
模块装载断点(&M)...
17.
The software and hardware design of remotely controlled sealing and unsealing of plugging module
封堵模块遥控密封和解封的软硬件设计研究
18.
password protected load module file
口令保护装入模块程序