1.
Understanding and Accelerating the UL Qualification Process for Lead Free Materials;
了解与加快无铅材料的UL认证审核过程
2.
DETERMINATION OF ANAND PARAMETES FOR Pb-FREE MATERIAL SnAgCu AND LIFE PREDICTION FOR A CSP STRUCTURE
无铅材料SnAgCu的Anand参数测定和CSP焊点寿命预测
3.
Research Progress of Lead-free Ferroelectric BaTi_2O_5
无铅铁电材料-BaTi_2O_5的研究进展
4.
Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。
5.
Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。
6.
Preparation and Electrical Properties of BNT-based Lead-free Piezoelectric Ceramics;
BNT基无铅压电陶瓷材料的制备与电性能的研究
7.
Corrosion Research of Different Lead Free Wave Solder Pot Materials;
无铅波峰焊不同锡炉材料溶蚀行为研究
8.
Fabrication and Research on Lead-free Capacitor Ceramics;
无铅陶瓷电容器介质材料的制备与性能的研究
9.
Study on the Properties of Sodium Potassium Niobate-based Lead-free Piezoelectric Ceramics
铌酸钾钠基无铅压电陶瓷材料的性能研究
10.
Study on the Preparation and Properties of Sodium Potassium Niobate-based Lead-free Piezoelectric Ceramics;
铌酸钾钠基无铅压电陶瓷材料的制备与性能研究
11.
Fabrication and Research on Lead-free Capacitor Ceramics with Perovskite Type Structure;
无铅钙钛矿结构陶瓷电容器介质材料的制备与介电性能的研究
12.
Effects of Doping on Alkaline Niobate Lead-Free Piezoelectric Ceramics;
掺杂改性对铌酸盐无铅压电陶瓷材料性能的影响
13.
Design and Study on Properties in Sn-Based High Multicomponent Temperature Lead-Free Solders
Sn基多组元高温无铅焊接材料的设计及性能研究
14.
Analysis of Lead in Blood, Hair and Nail Samples from Resident Exposed to Lead Pollution in Soil
某土壤铅污染地区人群生物材料铅含量分析
15.
The Study on Mixture Design of Multiplex Sn-Zn System Lead-free Solder;
多元Sn-Zn系无铅钎料混料设计的研究
16.
The Research of Sn-Zn System without Ag Lead-free Solder
新型Sn-Cu系无银无铅焊料的研究
17.
caulking of lead fibres, for pipe joints
堵缝材料,铅丝制,用于管道连接
18.
High precision welding materials pure tin lead alloy products.
高级精密焊接纯锡铅合金材料制品。