1.
Research on the thermal stress and warpage of WLCSP device
晶圆尺寸级封装器件的热应力及翘曲变形
2.
Reliability of SOP Component Solder Joint
小尺寸封装(SOP)器件焊点可靠性研究
3.
Packaging--Dimensions of cylinder transport package
GB/T13201-1997圆柱体运输包装尺寸系列
4.
Thermal Stress Analysis of Stacking Chip Scale Package under Power Load;
功率载荷下叠层芯片尺寸封装热应力分析
5.
A Study on Thermal Stress and Invalidation for Chip Scale Package;
芯片尺寸封装（CSP）的热应力及热失效分析研究
6.
SIZE EFFECT OF MECHANICAL BEHAVIOR OF MINIATURE SOLDER JOINT INTERCONNECTIONS IN ELECTRONIC PACKAGING
电子封装微互连焊点力学行为的尺寸效应
7.
Woodruff keys--Types and dimensions
GB/T1099-1979半圆键型式尺寸
8.
sizematic internal grinder
自动定尺寸内圆磨床
9.
Study on Al Pad Contamination Sources During Wafer Fabrication,Shipping and Assembly
晶圆制造、运输、封装过程中Al焊垫污染源的研究
10.
Eventually closed all the screw compressor assembly drawings, plans and dimensions of all the main components map.
最终形成全封闭螺杆压缩机总装配图、形尺寸图和各主零件图。
11.
Pressureless Infiltration of SiCp/Al Electronic Packaging Materials with Particles of Bimodal Size Distribution;
无压浸渗制备双尺寸颗粒SiCp/Al电子封装材料的研究
12.
Finite-Element Simulation and Solder Joint Life Predictions for Chip Scale Ball Grid Array Size Package;
球栅阵列尺寸封装的有限元法模拟及焊点的寿命预测分析
13.
Study on Size Effect of Induction Heatng and Characteristics of Induction Heatng Interconnection Technology for BGA Packaging
电磁感应加热尺寸效应及其BGA封装互连新方法特征研究
14.
Integrated power electronics module based on chip scale packaged power devices
基于芯片尺寸封装功率器件的集成电力电子模块(英文)
15.
a graded change in the magnitude of some physical quantity or dimension.
数量尺寸的级别变化。
16.
middle-of-the-road class
(小客车等的) 中等尺寸级
17.
Mechanism and Process of Cu-Sn Bonding for Wafer Level MEMS Packaging
MEMS圆片级封装用Cu-Sn低温键合机理与工艺研究
18.
End-suction centrifugal pumps--Baseplate and installation dimensions
GB/T5660-1985轴向吸入离心泵底座尺寸和安装尺寸