1.
Function of Instrument Package Driver Technology Interchangeability
功能封装的仪器驱动程序可互换性实现技术
2.
Research on the architecture of manufacturing grid with function encapsulation
面向功能封装的制造网格体系结构研究
3.
Implementation Technique of Instrument Driver Interchangeability Based onFunctional Package
基于功能封装的仪器驱动程序可互换性实现技术研究
4.
The Research of Small Form Factor Pluggable Transceiver with Digital Diagnose Monitor Function;
带数字诊断功能的小封装光模块研究
5.
The Packaging Structure and Development Trend of Intelligent/smart Power Module
智能功率模块的封装结构和发展趋势
6.
Power Electronics Modules Packaging and Integrative Packaging--Focusing on the Renewable Energy and Electric Vehicles
功率模块的封装和“一体化”封装——一针对可再生能源和电动交通工具
7.
The Research of IC Packaging Successful Factor and Core Competence;
IC封装企业成功要素的探讨与核心能力的培育
8.
Study on Preparation and Performance of Aluminum Substrate for Heat Dissipation of High-power LED
大功率LED封装用散热铝基板的制备与性能研究
9.
Influence of Fluorescent Glue Packaging Technology on the Color Rendering Index of High Power LED
大功率LED荧光胶封装工艺对其显色性能的影响
10.
The technology of the mainshaft sealed apparatus has got the state patent it has two funetions of electric and steam heating.
主轴密封装置获国家主利。具有电、汽两种加热功能。
11.
This array wrapper class enhances the functionality of an integer array in a number of ways.
这个数组封装器以多种方式提高了一个整数数组的功能。
12.
Analysis on the Relation between EMC Property and Packaging Defect
浅析环氧塑封料性能与器件封装缺陷
13.
Development of Packaging Design of High-Power White LED
功率型白光LED封装设计的研究进展
14.
Sintering Technology of Power Modules:A Packaging with Good Design
功率模块的烧结技术——良好设计的封装
15.
Reasearch on Encapsulation Technology Reliability of High Power White-Light LED
大功率白光LED封装技术可靠性研究
16.
Comparison between Two Electrodes for High-Power LED Packaging
两种新型大功率LED封装电极层的比较
17.
Research & Fabrication of Packaging Technology for High-Power White LED
大功率白光LED封装工艺技术与研制
18.
Current Situation of High-Power LED Encapsulant
大功率LED器件封装材料的研究现状