1.
Comparative Research of Micro-BGA Reliability Under Bending Stress
弯曲应力状况下微型BGA封装可靠性比较
2.
Study on the Microelectronic Solder Balls Preparation Method;
微电子BGA 焊球制备方法的研究
3.
Solder Joint Fatigue Life Predicton with Submodel for a BGA Package;
子模型法预测BGA封装中焊点的热疲劳寿命
4.
Study on the degradation of acidic blue BGA by photocatalytic oxidation based on microwave electrodeless UV lattice
微波无极紫外点阵光催化氧化降解酸性蓝BGA的研究
5.
The Technology of the Detection for Defects in BGA Package Based on Flat Panel Detector
基于平板探测器的BGA缺陷检测技术
6.
Effect of BGA Solder Joint Void on Signal Transmission Performance
BGA焊点空洞对信号传输性能的影响
7.
Influence of Spheroidization Temperature on Quality of BGA Solder Ball
球化温度对BGA钎焊球质量的影响
8.
Application of Fuzzy-PID in the Temperature Control System of BGA Rework Station
模糊PID在BGA返修站温度控制中的应用
9.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
10.
microelectronic modular assembly
微电子学微型组件装置
11.
Analysis on Mechanical Behavior of BGA Solder Joints under Shock Loading;
冲击载荷下BGA封装焊点的力学特性研究
12.
Study on Thermal Mechanism of Solder Bumps Reflowed by Induction Self Heating;
感应自加热（ISHR）重熔BGA凸台发热机理研究
13.
The Research and Development of Laser-Soldering System Based on BGA Chips;
基于BGA芯片的激光植球系统的设计与研究
14.
BGA Assembly Technology Research for Solder Ball's Reliability
对BGA封装技术中锡球焊接可靠性的研究
15.
Analysis on Thermal Stress and Thermal Reliability of BGA Packaging
BGA封装的热应力分析及其热可靠性研究
16.
Influence of Spheroidization Temperature on Real Sphericity and Surface Quality of BGA Solder Ball
球化温度对BGA钎焊球真球度及表面质量的影响
17.
Defects inspection and MATLAB realization of BGA chips based on machine vision
基于机器视觉的BGA芯片缺陷检测及其MATLAB实现
18.
Application of ESPI in Solder Ball Failure Test on Board-Level BGA Package
ESPI在板级BGA封装器件焊球失效检测中的应用