1.
Effects of process parameters on the textures of tungsten coatings electrodeposited from Na_2WO_4-WO_3-ZnO molten salts
双向脉冲电镀工艺参数对Na_2WO_4-ZnO-WO_3熔盐镀钨层织构的影响
2.
Effects of pH values on the quality of plated Ni-W alloy coating
pH值对镍钨合金镀层电镀质量的影响
3.
Effect of temperature on the quality of electro-deposited Nickel-Tungsten coating
温度对镍钨合金镀层电镀质量的影响
4.
PERFORMANCE OF ELECTROLESS Ni-P COATING ON W-Cu ALLOY
钨铜合金表面化学镀Ni-P镀层性能研究
5.
Study on electrodeposition process and properties of copper–tungsten composite coating
铜-钨复合镀层电沉积工艺及其性能
6.
Effects of NiSO_4 content in plating bath on the quality of Ni-W alloy coating
镀液中硫酸镍浓度对镍钨合金镀层电镀质量的影响
7.
Cobalt-tungsten electrodeposit as copper barrier was presented in the paper.
本文提出以电镀钴钨二元合金镀层作为防铜渗层。
8.
Research on the Preparation of CNTs/WC Powder and Ni Matrix Composite Coating
纳米碳管碳化钨复合粉体及其镍基复合镀层
9.
Composition of cobalt-tungsten deposit was changed with the change of tungsten concentration and current density in plating solution.
实验表明，随着镀液中钨离子浓度的不同和电流密度的改变，钴钨合金镀层组成不同。
10.
Meanwhile, properties of cobalt-tungsten, nickel, cobalt deposit as copper barrier at temperature between400℃ and800℃ were compared.
同时比较了在400～00℃，钴钨合金镀层与镍层、层的防铜渗能力。
11.
Results showed cobalt-tungsten deposit as copper barrier at temperature of500℃ and below was superior to nickel, cobalt deposit.
当温度低于500℃，钴钨合金镀层的防铜渗性能优于后二者。
12.
Study on Corrlsion resisting Performance of Amorphous Ni P and Ni W P Composed Film
非晶态镍磷和镍钨磷双层复合镀膜的耐蚀性能研究
13.
Study on H_2S corrosion resistance of tungsten alloy plated sucker rod
电镀钨合金抽油杆耐硫化氢腐蚀研究
14.
The Research on Brazing Process betweeen W-Cu Heat Sink with Plated Nickel and Silver-copper Solder
镀镍钨铜与银铜焊料钎焊工艺的研究
15.
Determination of Tungsten in Ni-W-P Alloy Electroplating Solution
Ni-W-P合金电镀液中钨的测定
16.
Plating Technology and Properties of Electroless Ni-Mo-P Alloy Coatings
化学镀Ni-Mo-P合金镀工艺及镀层性能
17.
Mass Calculation of coating (For equal coating)/MM
锌镀层质量(两个相同锌镀层厚度)
18.
The adhesive strength of the acid film was stronger than that of the alkali film.
碱性镀层的结合强度优越于酸性镀层。