1.
Technology of 3D Packaging and TSV
3D封装与硅通孔(TSV)工艺技术
2.
3D IC Stacking with TSV Interconnect
3D IC集成与硅通孔(TSV)互连
3.
An Investigation of Reactive Ion Etching for Through Silicon Via Packaging Technology
反应离子刻蚀在穿透硅通孔封装技术中的应用研究
4.
300mm Lithography and Bonding Technologies for TSV Applications in Image Sensor and Memory Products
在图像传感器和存储产品中应用硅通孔工艺的300mm光刻与键合技术(英文)
5.
Experimental Research of Micro-EDM for Through-Silicon-Via
硅阵列通孔微细电火花加工试验研究
6.
full isolation by porous oxidized silicon
多孔氧化硅完全隔离
7.
Study of the Growth of Silicon Carbide by APCVD on Porous Silicon Substrate;
基于多孔硅衬底的碳化硅APCVD生长研究
8.
Modification of Porous Silica Antireflective Coatings with Fluorine-Containing Organosilicon
含氟有机硅改性多孔二氧化硅减反膜
9.
Study on effect of porous silica prepared from wollastonite as reinforcer in silastic
硅灰石制多孔二氧化硅在硅橡胶中的应用研究
10.
Discussing of factors to affect the hydro thermal composite microporous calcium silicate in utilizing siliceous clay as raw miterials
硅质粘土水热合成微孔硅酸钙的影响因素探讨
11.
Theoretical Studies of Si-OH and SiO_2 Structures on Silicon and Porous Silicon Surface;
硅及多孔硅表面Si-OH、SiO_2结构的理论研究
12.
The Research of Synthetic Porous Silica by Wollastonite and Progress in Application
硅灰石合成多孔二氧化硅研究及应用进展
13.
MODIFICATION BY VAPOR SILYLATION OF NIOBIUM-CONTAINING HEXAGONAL MESOPOROUS SILICA
含铌六方介孔二氧化硅的气相硅烷化改性(英文)
14.
Fabrication of SOI Material Using Epitaxial Layer Transfer of Porous Silicon and Luminescence Study of Modified Porous Silicon;
多孔硅外延层转移SOI新材料制备与改性多孔硅发光性能的研究
15.
Study of Porous Silicon Modified by Surfactants and Temperature Dependence of Spectroscopy for Porous Silicon;
多孔硅的表面活性剂修饰及多孔硅光谱温度效应的研究
16.
Comparison of Optical and Electrical Properties of ZnS/Porous Silicon and ZnO/Porous Silicon Systems
硫化锌/多孔硅体系和氧化锌/多孔硅体系的光学和电学特性比较
17.
Synthesis and Characterization of Ordered Mesoporous Silica, Aluminosilicate and Titanosilicate Materials;
有序介孔氧化硅、硅铝酸盐、硅钛酸盐材料的合成与表征
18.
Synthesis and Characterization of Micro-and Mesoporous Titania-Silica Composite Materials;
微孔—介孔钛硅氧化物复合材料的合成与表征