1.
Study of AlN Thin Films Deposited on Mo Electrode by Reactive Magnetron Sputtering
Mo电极上磁控反应溅射AlN薄膜
2.
A Preliminary Study on Electrodeposition Process of Crystalline Composite Electrode - (Ni-Mo)-WC;
晶态复合电极(Ni-Mo)-WC的电沉积过程初步研究
3.
Preparation of Ni-Mo Alloy and Studies on Its Characterizations of HER;
Ni-Mo复合电极的制备及其析氢性能研究
4.
Electrochemical preparation and characteristics of (Ni-Mo)-TiO_2 composite coating used as electrode materials for hydrogen evolution
复合电沉积制备(Ni-Mo)-TiO_2电极及其电催化析氢性能
5.
The Spectra Characterization of Mo-S-Ag Cluster Compounds Modified Silver Electrodes and Their Electrochemical Activities;
Mo-S-Ag簇合物膜化学修饰电极的谱学性质及其电化学行为研究
6.
Determination of Be,B,Pb,Cu,Ag,Mo,Sn and Zn in the geological samples by deep hole electrode emission spectrography
深孔电极发射光谱法测定地质样品中Be、B、Pb、Mo、Sn、Cu、Ag、Zn
7.
Preparation and Study on the Raney Ni-Mo Active Cathode
雷尼Ni-Mo活性阴极的制备与研究
8.
Current-mode Multifunctional Filter Based on MO-OTAS and CCCII
基于MO-OTAS和CCCII电流模式通用滤波器
9.
Electrochromic Properties of WO_x-Mo Thin Films on Polyethylene Terephthalates Soft Substrate
柔性衬底WO_x-Mo薄膜电致变色性能研究
10.
A Study of Electrodepositing La-Mo-ZrO_2 Coating and Its Property
电沉积La-Mo-ZrO_2及其性能的研究
11.
Preparation of Ni-Mo-P Active Cathode and Its Hydrogen Evolution Behabvior in Chlor-alkali Electrolyte Solution
Ni-Mo-P活性阴极制备及析氢行为的研究
12.
MO-CCCDTA-based electronically tunable current-mode comparator and its application
基于MO-CCCDTA电控调谐电流模式比较器及其应用
13.
monopolar needle electrode
单极针电极 单极针电极
14.
The search for accurate electronic wave functions of polyatomic molecules uses mainly the MO method.
寻求多原子分子的准确电子波函数主要用MO法。
15.
Numerical Simulation of the Electric Field-Activated SHS Process of Mo-C-Si System;
电场作用下Mo-C-Si系SHS过程的数值模拟
16.
Preparation of Mo/High-Carbon Steel Composite Coating by Wire Explosion Spraying
电爆炸喷涂制备Mo/高碳钢复合涂层的研究
17.
Performance of media corrosion and electrochemical corrosion of Ni-Cr-Mo-Cu alloys
Ni-Cr-Mo-Cu合金介质腐蚀和电化学腐蚀的性能
18.
The investigation on a new kind of Mo-Cu alloy material for electronic sealing material
新型低膨胀Mo-Cu合金电子封接材料研究