1.
System Research for Analysis the Package Thermal Reliability of IC Chips Based on Electronic Speckle Pattern Interferometer
基于激光电子散斑技术的IC芯片封装热可靠性分析系统研究
2.
The Reliability Analysis and Structure Parameter Opimization of Stacked Die Package;
叠层芯片封装可靠性分析与结构参数优化
3.
The Study on the Effects of Lead-free Solder on the Dynamic Reliability of the Packaged Chip;
无铅焊料对电子封装芯片动态可靠性影响的研究
4.
Experimental Investigation on the Performance of Devices for Heat Dispersing of Chips and Enclosure;
芯片及密封机柜散热装置的性能实验研究
5.
Reliability Analysis of PBGA Devices at Hygrothermal Environment
PBGA封装的耐湿热可靠性试验研究
6.
The rapid increase in the integrated degree and dimension of chips, the more I/ O pins number, fine line pitch and miniaturization in package would result in the degradation of reliability of electronic devices.
芯片集成度的提高和大面积化，封装多针脚、引线、型化等会引起器件可靠性的下降。
7.
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
8.
Effects of Voids on Thermal Reliability in Power Chip Die Attachment Solder Layer
空洞对功率芯片粘贴焊层热可靠性影响的分析
9.
Analysis on Thermal Stress and Thermal Reliability of BGA Packaging
BGA封装的热应力分析及其热可靠性研究
10.
Thermal Stress Analysis and Optimization of SCSP Chip Package
叠层CSP芯片封装热应力分析与优化
11.
Thermal-Mechanical and Hygroscopic Characteristics of Micro-electronic Packaging Polymer and Its Packaging Reliability Study;
微电子封装高聚物热、湿—机械特性及其封装可靠性研究
12.
Moisture Absorption Property of Material and Moisture&Thermal Affects on Package's Reliability
封装材料的吸湿特性及湿、热对封装器件可靠性的影响
13.
Reliability analysis of PBGA devices with different finishes under hygrothermal environment in lead-free electronics package
无铅封装中镀覆层对PBGA耐湿热可靠性的影响
14.
A Study on Thermal Stress and Invalidation for Chip Scale Package;
芯片尺寸封装（CSP）的热应力及热失效分析研究
15.
Thermal Stress Analysis of Stacking Chip Scale Package under Power Load;
功率载荷下叠层芯片尺寸封装热应力分析
16.
Thermal Design of High-Power LED Multi-Chip on Board Package
大功率LED多芯片基板上直接封装的热设计
17.
Progress of Anisotropic Conductive Adhesive for Flip Chip Packaging
倒装芯片封装材料—各向异性导电胶的研究进展
18.
Impact of Hot-Cutting Defect on Reliability of Ceramic Packaging and a Novel Concept of Structure Design;
热切缺陷对陶瓷封装可靠性的影响和一种结构设计新概念