1.
Fabrication and Characteristics of Good Ohmic Contact Electrode on Thermistor by Regional Electroless Cu-plating
热敏电阻局部化学镀铜制备良好欧姆接触电极及性能研究
2.
Local corrosion of electrodeposited multi-layers of AZ91D magnesium alloy and its processing of electroless plated Ni-P-Cu layers
AZ91D镁合金表面复合镀层局部腐蚀现象解析及化学镀Ni-P-Cu的研究
3.
PERFORMANCE OF ELECTROLESS Ni-P COATING ON W-Cu ALLOY
钨铜合金表面化学镀Ni-P镀层性能研究
4.
Research of Chemical Cu-plating on the CNF Absent of Palladium
无钯催化纳米炭纤维化学镀铜的研究
5.
Electroless Ni-P/Ni-Cu-P Coatings on AZ91D Magnesium;
AZ91D镁合金化学镀镍磷/镍铜磷
6.
The study of electrochemical behaviors for a citrate alkaline copper plating bath
柠檬酸盐碱性镀铜的电化学行为研究
7.
Electroless Copper Plating Technology for PTFE
聚四氟乙烯表面化学镀铜的工艺研究
8.
A Pretreatment Technology of Direct Electroless Copper Plating on Steel Matrix
钢铁基件直接化学镀铜的预处理工艺
9.
Preparation of core-shell Cu-Ag bimetallic powders via electroless plating
化学镀法制备核壳型银-铜双金属粉
10.
Electrochemical behavior of copper deposit on iron electrode in HEDP bath
铁电极上HEDP镀铜的电化学行为
11.
Synthesis and Electrochemical Properties of a Copper Plating Additive
电镀铜添加剂的合成及其电化学性能
12.
Optimization of bath composition for electroless copper plating on aluminum nitride ceramic surface
氮化铝陶瓷表面化学镀铜溶液组成的优化
13.
Electroless copper plating on the micro-arc oxidation film without Pd activation
微弧氧化陶瓷表面无钯活化化学镀铜的研究
14.
Optimization of Electroless Plating Ni-P Alloy Technology on the Surface of Brass Substrate;
黄铜基体化学镀Ni-P合金工艺优化研究
15.
Sintering behavior of Mo/Cu composite powders prepared by electroless copper plating on molybdenum powders
钼粉表面化学镀铜复合粉末烧结致密化
16.
Research of Electroless Copper Plating Technology of Carbon Fiber and Its Friction Performances
碳纤维表面化学镀铜工艺优化及摩擦性能研究
17.
The microstructure of electroless copper deposit is greatly effected by the substrate upon which deposition occurs.
化学镀铜层的显微结构受基体的显著影响。
18.
A Study on the Technology of Electroless Copper Plating with Sodium Hypophosphite as Reductant;
以次亚磷酸钠为还原剂的化学镀铜工艺研究