1.
A Study of the Bonding Reliability for the Anisotropic Conductive Adhesive Film;
各向异性导电胶膜粘接可靠性的研究
2.
The Preparation of Compliant Conductive Micro-spheres for ACF;
各向异性导电胶膜用柔性导电微球的制备
3.
The Recent Development of Anisotropic Conductive Adhesive Films for Microelectronic Packaging
微电子封装用各向异性导电胶膜的研究进展
4.
Experimental Study on Viscoelastic Mechanical Behaviors for Anisotropic Conductive Adhesive Film
各向异性导电胶膜黏弹性力学行为的实验研究
5.
Numerical Simulation and Experiment on Interfacial Damage of Anisotropic Conductive Film Bonding
各向异性导电胶膜损伤破坏试验与数值分析
6.
Preparing and Research on Conductive Particles Applied in Anisotropic Conductive Film
适用于各向异性导电胶和导电膜的导电微粒的制备与研究
7.
A Method of ACF(Anisotropic Conductive Films)Process Evaluation
ACF各向异性导电胶的工艺评价方法
8.
Research Progress in Anisotropic Conductive Adhesives for Microelectronic Packaging
微电子封装用各向异性导电胶的研究进展
9.
The Research of the Electroless Plating on the Soft Microspheres Applied in the ACA;
各向异性导电胶中柔性颗粒化学镀镍研究
10.
Progress of Anisotropic Conductive Adhesive for Flip Chip Packaging
倒装芯片封装材料—各向异性导电胶的研究进展
11.
Shear Strength of Flip Chip Packaging Bonded with Anisotropic Conductive Film
倒装芯片各向异性导电胶互连的剪切结合强度
12.
EXPERIMENTAL STUDY ON CREEP-RECOVERY MECHANICAL BEHAVIOR OF ANISOTROPIC CONDUCTIVE ADHESIVES
各向异性导电胶蠕变—恢复力学行为研究
13.
anisotropic dielectric waveguide
各向异性电介质波导
14.
Study on Preparation and Properties of Isotropic Copper Filled Conductive Adhesive
各向同性铜粉导电胶的制备及性能研究
15.
Influence of Buffer Layer on the Anisotropic Magnetoresistance of NiCo Films;
缓冲层对NiCo薄膜各向异性磁电阻的影响
16.
Impact of the Ni80 Fe20 film parameter over aeolotropism resistivity
Ni80 Fe20薄膜的参数对其各向异性电阻率的影响
17.
Field Strength by Linear Electrified Conductor in Anisotropic Dielectric;
线状带电导体在各向异性介质中产生的电场
18.
EXPERIMENTAL STUDY ON CRITICAL CURRENT ANISOTROPY OF HTS TAPES UNDER DC MAGNETIC FIELD
高温超导带材的临界电流各向异性的实验研究