1.
Methods Discussion on How to Improve Final Test Yield of Power MCM
提高功率多芯片模块终测成品率的方法探讨
2.
Integrated power electronics module based on chip scale packaged power devices
基于芯片尺寸封装功率器件的集成电力电子模块(英文)
3.
High Power IGBT Modules with Improved Mechanical Performance and Advanced 3.3kV IGBT3 Chip Technology
具备更强机械性能的高功率IGBT模块——采用最新3.3kV IGBT3芯片技术
4.
The research of the function module division ways in fault chip test
故障芯片测试中功能模块划分方法研究
5.
This paper detailedly introduces the master circuit of the frequency transformation speed regulation, IPM, and interface circuit with DSP.
文中对变频部分的主电路、智能功率模块IPM和dsp芯片及其周围接口电路都作了详细地介绍。
6.
The Design of Loop Filter Module in a Multi-mode Video Decoder Chip;
多模视频解码芯片中环路滤波模块的设计
7.
A Kind of Image Module Based on Several Chips;
基于多处理芯片嵌入式图像处理模块的设计
8.
Design of real-time corner transformation module on multi-DSP chip for SAR
基于多DSP芯片的实时SAR雷达转角变换模块设计
9.
Design of Stepper Motor Driver Based on SMA7029M
基于SMA7029M多芯片模块的步进电机驱动设计
10.
Thermal Design of High-Power LED Multi-Chip on Board Package
大功率LED多芯片基板上直接封装的热设计
11.
SOAC System On a Chip
系统集成多功能芯片
12.
Low Power Design of Multi-mode Switching Power Supply Controller IC
多模式开关电源控制芯片的低功耗设计
13.
Electrical system measuring and controlling instrument based on AT73C500 chipset
基于AT73C500芯片的无功功率补偿测控仪
14.
Research on Modeling and Simulation of Boundary Heat Transfer Process of High-Power IC Chip;
大功率集成电路芯片界面传热过程建模与仿真研究
15.
Design of Reed-Solomon Decoder for QAM Demodulate IC;
QAM解调芯片中Reed-Solomon解码模块的设计
16.
VLSI Design of Macroblock in the Chip of H.264 Decode;
H.264解码芯片宏模块部件的VLSI设计
17.
Development of Test Program for A/D Module of PCU03-ABS;
PCU03-ABS芯片A/D模块测试程序开发
18.
The Pivotal Module Physical Design of YHFT-DX
YHFT-DX芯片关键模块的物理设计