1.
Alumina ceramic substrates for thin film integrated circuits
GB/T14620-1993薄膜集成电路用氧化铝陶瓷基片
2.
circuit, integrated hybrid, thin or thick film
混合集成电路,薄膜或厚膜的
3.
Study of MOCVD TiN in Advanced Semiconductor Manufacturing;
MOCVD TiN薄膜在先进集成电路制造中应用的研究
4.
High Voltage PDP Data Driver IC Based on Thin Layer SOI
基于薄膜SOI的PDP高压寻址驱动集成电路
5.
Research on the Fabrication of High-k Dielectric Films and the Discussion of Integrated Thin Film Capacitor;
高k电介质薄膜制备研究与集成薄膜电容探讨
6.
circuit, thin or thick film, consisting solely of passive elements
薄膜或厚膜电路,仅由无源元件组成
7.
The Morphological Evolution for a Void in Thin-film Interconnect of Integrated Circuit Analyzed by Phase-field Method
集成电路薄膜导线中孔洞形貌演化的相场法研究
8.
Research of WN film as diffusion barrier layer in ULSI-Cu metallization
集成电路亚45nm级铜布线扩散阻挡层WN薄膜的研究
9.
passive hybrid film integrated circuit
无源混合膜集成电路
10.
film mounted ic
膜载组装的集成电路
11.
Generic specification for film integrated circuits and hybrid film integrated circuits
GB/T8976-1996膜集成电路和混合膜集成电路总规范
12.
A new technique for fabricating EMIF in thin film IC based on superfine processing technique is proposed.
提出一种基于集成电路超微细加工技术制造电磁干扰滤波器的薄膜集成制造新技术。
13.
Case outlines for film integrated circuits and hybrid integrated circuits
GB/T15138-1994膜集成电路和混合集成电路外形尺寸
14.
Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure
GB/T13062-1991膜集成电路和混合膜集成电路空白详细规范(可供认证用)
15.
Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
GB/T16465-1996膜集成电路和混合膜集成电路分规范（采用能力批准程序）
16.
The preparation and properties of the dielectric/semiconductor functional integrated thin films
介电/半导体功能集成薄膜的制备和特性调控
17.
The Reliability-Analysis for HIC and Its Improvement;
厚膜混合集成电路可靠性分析与提高
18.
Important Technique Problems in Silk Screen Printing for Thick Film Integrated Circuits
厚膜集成电路网印应注意的技术问题