1.
The Application of Electroless Pure Palladium Deposition for Surface Finishing on Print Circuit Boards
无电镀纯钯应用于印刷电路版表面处理上之研究
2.
Study on Plating 22K Au-Cu Alloy in Cyanide Free Bath;
无氰电镀22K金—铜合金工艺研究
3.
Black Tarnishing Phenomenon of Chromate-Free Anti-Fingerprint Galvanized Steel Sheet
无铬型耐指纹电镀锌板黑变现象探究
4.
Study on the Process of Cu-Sn-Zn Cyanide-free Gold Imitation Plating
Cu-Sn-Zn三元无氰仿金电镀工艺研究
5.
A Study of the Plating Process for Preparing Sn-Cu Lead-Free Solders by Electrodeposition
电沉积制备Sn-Cu无铅钎料电镀工艺的研究
6.
Study on Lead-free Weldable Coating of Chip Electronic Components
片式电子元器件中无铅可焊镀层的研究
7.
Preparation and Properties of Aluminum and Aluminum Alloy Coatings Electroplated from Inorganic Molten Salt;
无机熔融盐电镀铝及其合金的工艺与性能研究
8.
Investigation on Cyanide-free Alkaline Copper Electroplating and Eletrochemical Behavior
无氰碱性镀铜工艺及其电化学过程的研究
9.
Effects of Current Density on Properties of Low-Temperature Iron Plating without Pre-etching
电流密度对无刻蚀低温镀铁性能的影响
10.
One nondestructive evaluating method of galvanized sheet quality in resistance spot welding
一种镀锌板电阻点焊质量的无损评判方法
11.
To galvanize or plate(metal)by immersion.
电镀通过浸泡镀涂金属
12.
Electro galvanized Steel Sheet
电镀锌(电解)钢片
13.
To coat with tin, either by dipping or electroplating.
镀锡在…镀锡，通过浸染或电镀的方式
14.
Surface Functionalization and Electroless Copper Deposition of the Fluoropolymer Films;
含氟聚合物薄膜表面功能化及其表面无电电镀应用
15.
Non-Cyanide Silver Electroplating Using DMH as Complexing Agent and Investigation on Electrodeposition Behaviors;
基于DMH为配位剂的无氰电镀银工艺及电沉积行为研究
16.
Process of non-cyanide silver plating for molybdenum foils used as inter-links of solar cell array system in space vehicle
航天器太阳能电池阵互连片钼箔无氰电镀银工艺
17.
Coat the surface with either nickel or copper (nickel is now generally the preferred commercial process) from an electroless plating solution.
用镍或者铜在无镀电镀液中进行表面处理，目前镍是更流行的商业用工艺。
18.
This workshop covers lead-free surface finishes for components, connectors and print circuit board.
这次课程涵盖了元件、接器和印刷电路板的无铅表面镀层。