1.
ATOMM Advanced super Thin-layer and high-Output Metal Media
增强形超薄高速金属媒体
2.
Ultra-thin C-N-Si Protective Films Prepared by Plasma Enhanced Deposition;
等离子体增强沉积C-N-Si超薄保护膜
3.
Design of the Organism of the Super-hardness Piled Metal for Better Toughness;
超高硬度堆敷金属强韧化的组织设计
4.
Optimum Design of Ultra-thin Diamond Saw-blade for High-speed Circular Sawing
高速锯切用超薄金刚石圆锯片的优化设计
5.
Characteristics of Debris Cloud Produced by Normal Hypervelocity Impact of Spherical Projectile with Thin Aluminum Plate;
球形弹丸超高速正撞击薄铝板碎片云特性研究
6.
Experimental investigation for deformation and fragmentation of spheres penetrating sheets at hypervelocity
球形弹丸超高速正撞击薄板破碎状态实验研究
7.
refractory metal fibre reinforced ceramic
耐高温金属纤维增强陶瓷
8.
enhancement MOS device
增强型金属氧化物半导体器件
9.
enhancement depletion mos
增强型 耗尽型模式金属氧化物半导体
10.
Enhanced Adhesion Effects Induced by Fast Heavy Ion Beams for Matel Film on Insulator and Matel Film on Si Substrates
快重离子束诱发金属薄膜在基底上的附着增强效应
11.
The Numerical Simulation Studies on Surface Electromagnatic Enhanced Raman Scattering of Spherical Metallic Nanometer Particles-metallic Film
纳米微球—薄膜金属结构表面拉曼散射电磁增强数值模拟初步研究
12.
metal formed into a thin plate.
形成一个金属薄板的金属。
13.
THE CHIP FORMATION MECHANISM OF HARD PARTICLE REINFORCED METAL MATRIX COMPOSITES
硬脆颗粒增强金属基复合材料的切屑形成机理
14.
Study on the Enhancement of Bongding Strength for High Velocity Oxy-Fuel Sprayed Cermet Coating;
超音速火焰喷涂金属陶瓷涂层结合强度强化方法的研究
15.
The deposition rate increases with the increasing of bias voltage pressure.
类金钢石薄膜的沉积速率随极板负偏压、体工作压力的增加而增大。
16.
metal sealed UHF and low noise silicon transistor
金属壳超高频低噪音硅晶体管
17.
Photoluminescence Enhancement of Silicon-based Semiconductor Materials by Coupling with Metal Surface Plasmon
金属表面等离子体增强硅基半导体材料发光
18.
Production of Bulk Metallic Glass by Rapid Compression and Phase Transition under High Pressure;
快速增压法制备大块金属玻璃及金属玻璃的高压相变研究